Excessive stencil printing dwell time of Solder Paste directly affects its performance. The Flux in the solder paste will gradually volatilize, leading to reduced tackiness.

After the solder paste tackiness decreases, uneven printing is prone to occur. This phenomenon is particularly noticeable on fine-pitch components.

Solder paste left on the stencil printing table for more than 4 hours will begin to experience tackiness reduction. It is recommended to use it as soon as possible after each printing.

Prolonged exposure of solder paste to air will cause it to absorb moisture. Moisture affects soldering quality, leading to cold solder joints or bridging.

After absorbing moisture, the flowability of solder paste deteriorates, easily causing blurred print outlines. This problem is more likely to occur on high-density PCBs.

Reflow Soldering must be completed within the specified time after solder paste printing. If the waiting time is too long, the solder paste may have already failed.

Reflow soldering should be performed immediately after solder paste printing. A delay of more than 1 hour may affect the soldering result.

Solder paste should be stored away from high-temperature environments. High temperatures accelerate flux decomposition and shorten the effective service life.

Opened solder paste must be used as soon as possible. Unused solder paste should be sealed and stored to avoid contact with air.

The dwell time during the solder paste printing process must be strictly controlled. Solder paste that exceeds the specified time should be replaced with new solder paste.