Application Features
- Suited to tiny components, resisting slump and bridging
- FPC resists cracking and detachment under bending
- Protects heat-sensitive components, compatible with multiple reflow profiles
- Stable printing supporting high yield in large-volume production
Industry Challenges
Products are becoming thinner and lighter, making micro components highly prone to solder bridging and insufficient solder.
FPC flexible cables are susceptible to solder joint cracking after repeated bending.
High-speed mass production imposes extremely high requirements on soldering yield.
Most components are heat-sensitive, limiting the reflow temperature window.
Core Advantages
Precision Printing for Micro Devices
Compatible with 0201 and 01005 micro components, with stable forming performance, effectively suppressing bridging and insufficient solder, and meeting the high-density assembly requirements of thin and light products.
Flexible and Bend-Resistant Solder Joints
Excellent solder joint toughness, suitable for repeated bending of FPC flexible boards, reducing the risk of solder joint detachment and cracking during consumer product use.
Wide Process Window
Multiple high and medium temperature alloys available, compatible with heat-sensitive components, high reflow process tolerance, and reduced thermal damage to devices.
High Yield for High-Speed Mass Production
Solder Paste features anti-slump and anti-cold-soldering properties, compatible with high-speed SMT production lines, ensuring continuous printing stability and improving mass production yield.
Excellent Wetting Performance
Smooth solder wetting on various pads and coatings, reducing cold solder and missed solder joints, suitable for mixed-assembly circuit boards in mobile phones, tablets and other devices.
Controllable Cost and Stable Batch Consistency
Stable alloy composition control, minimal batch variation, meeting the cost reduction and large-scale delivery requirements of consumer electronics.
Product Application Solutions
Solder Paste · SMT Reflow Soldering
For motherboard SMT assembly of mobile phones, tablets and earphones, soldering of micro components and BGA/QFN packages. Multiple high and medium temperature solder paste options available, with anti-slump and stable printing performance.
Solder Bar · Wave Soldering / Dip Soldering
For through-hole soldering of power boards and interface boards, with stable solder surface and uniform wetting, suitable for high-volume through-hole production of consumer electronics.
Solder Wire · Hand Soldering / Repair
For prototype debugging, production line touch-up soldering and after-sales repair, with minimal spatter and bright solder joints, suitable for rework operations of consumer terminals.
Application Coverage
Smartphones
Motherboard / FPC Cable / Charging Module
Tablets
Main Control Board / Display Module Board
TWS Earphones
Charging Case Board / Earphone FPC Board
Smart Wearables
Watch Motherboard / Sensor Sub-board
Typical Process Scenarios
SMT Reflow Soldering
High-speed SMT assembly of thin and light motherboards, precision soldering of micro components, anti-slump and high yield.
Wave Soldering / Selective Wave Soldering
Through-hole soldering for power and interface components, sufficient solder penetration, reduced cold solder defects.
Hand Soldering / Rework
Prototype debugging, production line touch-up soldering, terminal after-sales repair, easy to operate.
Quality Assurance
Jia Jinyuan consumer electronics dedicated solder paste, solder bars and solder wires comply with IPC?J?STD?006C standards and meet RoHS environmental requirements. Multiple alloy systems are available, with stable printing performance, flexible and reliable solder joints, suitable for large-scale manufacturing of consumer electronic products such as mobile phones, tablets, earphones and smart wearables.
