*Some tables can be scrolled horizontally to view parameters
| Model | Application | Halogen | Type | Alloy Powder |
|---|---|---|---|---|
| Leaded Solder Paste 8MN/7RN |
High activity, designed for QFN/DFN applications requiring high solder wetting; bright solder joints; | 600~750ppm ROL1 |
Rosin Type | Alloy powder options: 62362/62836804/6337/6040 T2.5, T3, T4 |
| Leaded Solder Paste 7M/7R |
Suitable for high-precision and general applications including communication devices, tablets, laptops and mobile phones; bright solder joints; | 250~400ppm ROL0 |
Rosin Type | Alloy powder options: 62362/62836804/6337/6040/5545 T2.5, T3, T4, T5 |
| Leaded Solder Paste 7MTWT/7RTWT |
Suitable for high-precision and general applications including communication devices, tablets, laptops and mobile phones. It remains stable after prolonged post-print standing without solder blackening or solder ball formation; bright solder joints; | <500ppm ROL0 |
Rosin Type | Alloy powder options: 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 T2.5, T3, T4, T5 |
| Leaded Solder Paste 7MTHT/7RTHT |
Specially formulated for outdoor display panels; stable viscosity and extended stencil life (key advantage); bright solder joints; concentrated rosin residue prevents screen mottling and ensures uniform ink tone. | 250~400ppm ROL0 |
Rosin Type | Alloy powder options: 62362/62836804/6337/6040 T2.5, T3, T4, T5 |
| Leaded Solder Paste 7MH/7RH |
General-purpose grade with transparent, bright residue. Well suited for white PCBs such as LED boards, featuring excellent dry resistance and supports continuous printing over 16 hours. Solder paste can be stored at ambient temperature. It maintains stability after long post-print dwell time with no solder splattering and minimal solder balls. | 250~400ppm ROL0 |
Rosin Type | Alloy powder options: 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 T2.5, T3, T4 |
| Leaded Solder Paste 7ML/7RL |
Transparent and bright residue. Ideal for white PCBs like LED boards, with moderate dry resistance, recommended for high-throughput applications. It can also be applied to grooved embedded heat sinks to achieve low voiding rates. | 250~400ppm ROL0 |
Rosin Type | Alloy powder options: 62362/62836804/6337/6040/5545/55X/50X/45X/40X/434314 T2.5, T3, T4 |
| Leaded Solder Paste 7MF/7RF |
Designed for silver pads including silver-plated electronic ceramic components, photovoltaic cells and glass screens for light shows. It will not corrode silver pads or cause pad blackening; | 150~350ppm ROL0 |
Rosin Type | Alloy powder options: 62362/62836804/6337/6040/5545 T2.5, T3, T4 |
| Zero-Halogen Water-Wash Leaded Solder Paste 3MWTH/3RWTH |
Suitable for high-cleanliness requirements, fully cleanable with water for faster cleaning speed. Zero halogen (0.00%), eco-friendly and biodegradable to reduce wastewater treatment costs. Delivers outstanding cold and hot slump performance under high temperature & humidity to avoid bridging. Viscosity remains stable during extended printing. | 0ppm ORL0 |
Water-Wash Type | Alloy powder options: 62362/62836804/6337/6040/5545/5050/4555/4060/3565/3070/2575/2080/1585/1090/595 T2.5, T3, T4, T5 |
| Leaded Solder Paste for Stainless Steel 3MW5S/3RW5S |
Direct soldering for stainless steel substrates; cleanable with water; | ORH1 | Water-Wash Type | Alloy powder options: 62362/62836804/6337/6040/5545/5050/4555/4060/3565/3070/2575/2080/1585/1090/595 T2.5, T3, T4 |
| Leaded Solder Paste for Aluminum 3MW5A/3RW5A |
Direct soldering for aluminum substrates; cleanable with water. Also applicable for lead grid soldering of energy storage batteries; | ORH1 | Water-Wash Type | Alloy powder options: 62362/62836804/6337/6040/5545/5050/4555/4060/3565/3070/2575/2080/1585/1090/595 T2.5, T3, T4 |
Select the appropriate solder powder particle size based on your process requirements and product type
| Leaded Alloy Type | Melting Point (°C) | Soldering Temp. (°C) | T2.5 | T3 | T4 | T4.5 | T5 | T6 | T7 |
|---|---|---|---|---|---|---|---|---|---|
| Sn62Pb36Ag2 | 179 | 200-225 | ✔ | ✔ | ✔ | ✔ | ✔ | ||
| Sn62.8Pb36.8Ag0.4 | 181 | 200-225 | ✔ | ✔ | ✔ | ✔ | ✔ | ||
| Sn63Pb36.9Ag0.1 | 181 | 200-225 | ✔ | ✔ | |||||
| 6337 (Sn63Pb37) | 183 | 200-225 | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ |
| 6040 (Sn60Pb40) | 183-191 | 210-235 | ✔ | ✔ | ✔ | ||||
| 5545 (Sn55Pb45) | 183-203 | 225-245 | ✔ | ✔ | ✔ | ||||
| 5050 (Sn50Pb50) | 183-215 | 235-255 | ✔ | ✔ | ✔ | ||||
| 4555 (Sn45Pb55) | 183-227 | 245-265 | ✔ | ✔ | ✔ | ||||
| 4060 (Sn40Pb60) | 183-238 | 255-280 | ✔ | ✔ | ✔ | ||||
| 3565 (Sn35Pb65) | 183-248 | 265-290 | ✔ | ✔ | ✔ | ||||
| 3070 (Sn30Pb70) | 183-258 | 280-300 | ✔ | ✔ | ✔ | ||||
| 2575 (Sn25Pb75) | 183-260 | 280-300 | ✔ | ✔ | ✔ | ||||
| 2080 (Sn20Pb80) | 183-279 | 300-320 | ✔ | ✔ | ✔ | ||||
| 1585（Sn15Pb85） | approx. 183-285/295 | 305-335 | ✔ | ✔ | ✔ | ||||
| 1090（Sn10Pb90） | 268-301 | 320-340 | ✔ | ✔ | ✔ | ||||
| 595（Sn5Pb95） | 300-314 | 335-355 | ✔ | ✔ | ✔ | ||||
| Sn55/Pb41.5/Bi3/Sb0.5 | - | - | ✔ | ||||||
| Sn52/Pb42.5/Bi5/Sb0.5 | 170 | 190-220 | ✔ | ||||||
| Sn48/Pb48.6/Bi3/Sb0.4 | - | - | ✔ | ||||||
| Sn43/Pb49/Bi7/Sb1 | - | - | ✔ | ||||||
| Sn38/Pb52.5/Bi8/Sb1.5 | 173 | 190-220 | ✔ | ||||||
| Sn43Pb43Bi14 | 144-163 | 185-200 | ✔ | ✔ | ✔ | ||||
| Sn10Pb88Ag2 | 268-299 | 320-340 | ✔ | ✔ | |||||
| Sn5Pb92.5Ag2.5 | 287-296 | 315-335 | ✔ | ✔ | |||||
| Sn5Pb93.5Ag1.5 | 296-301 | 320-340 | ✔ | ✔ |
*Some tables can be scrolled horizontally to view parameters
| Model | Application | Halogen | Type | Alloy Powder |
|---|---|---|---|---|
| Halogen-Free Lead-Free High-Temp Solder Paste 8MQP/5RQ |
High activity, delivers maximum solder wetting (nearly 100%) for QFN/DFN and similar packages; | Single <900ppm / Dual <1500ppm ROL1 |
Rosin Type | Alloy powder options: 0307/105/305 T3, T4, T5 |
| Halogen-Free Lead-Free High-Temp Solder Paste 8MTSP/5RTS |
Moderately high activity, good solder wetting (70%-90%) for QFN/DFN and similar packages; low and bright residue; | <500ppm ROL0 |
Rosin Type | Alloy powder options: 0307/105/305 T3, T4, T5 |
| Halogen-Free Lead-Free High-Temp Solder Paste 8MNTTP/5RNTT |
Specially designed for high-precision applications including communication modules, tablets, laptops, mobile phones, Bluetooth devices and fingerprint locks; low and transparent residue; | 100~200ppm ROL0 |
Rosin Type | Alloy powder options: 0307/105/305/00507BN/00507B2N T3, T4, T5 |
| Zero-Halogen & REACH Compliant Lead-Free High-Temp Solder Paste 8M9P/5RR |
Zero halogen, ultra-low void rate, suitable for low-void and high thermal conductivity applications such as automotive lighting; low and transparent residue; | 0ppm ROL0 |
Rosin Type | Alloy powder options: 0307/105/305 T3, T4, T5 |
| Halogen-Free Lead-Free High-Temp Solder Paste 8MA |
Suitable for general and wide-pitch conventional applications such as LED lighting; low and transparent residue; | <900ppm ROL1 |
Rosin Type | Alloy powder options: 0307/0107/SC07/00507BN/00507B2N T3, T4 |
| Standard Halogen-Free Lead-Free Medium-Temp & Low-Temp Solder Paste 8M/2R (8MTHL/2RTHL) |
For lead-free medium and low-temperature applications for heat-sensitive components including LEDs, crystal oscillators, copper wire lights and transparent screens; | 800~900ppm ROL1 |
Rosin Type | Alloy powder options: Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58/Sn42Bi57Ag1/Sn49.6Bi48.5Ag1Cu0.9/high-reliability LT32S T2.5, T3, T4, T5 |
| Zero-Halogen Lead-Free Medium-Temp & Low-Temp Solder Paste 8MTZB/2RTZB |
Zero halogen (0.00%), high safety and reliability, for heat-sensitive components including LEDs, crystal oscillators, copper wire lights and transparent screens in lead-free medium / low temperature soldering; | 0ppm ROL0 |
Rosin Type | Alloy powder options: Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58/Sn42Bi57Ag1/Sn49.6Bi48.5Ag1Cu0.9/high-reliability LT32S T2.5, T3, T4 |
| Zero-Halogen Lead-Free Medium-Temp & Low-Temp Solder Paste 8MTZBF/2RTZBF |
Zero halogen (0.00%), high safety and reliability, for heat-sensitive components including LEDs, crystal oscillators, copper wire lights and transparent screens in lead-free medium / low temperature soldering; | 0ppm ROL0 |
Rosin Type | Alloy powder options: Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58/Sn42Bi57Ag1/Sn49.6Bi48.5Ag1Cu0.9/high-reliability LT32S/In52Sn48/In40.2Sn20.7Bi39.1 T5, T6, T7 |
| Zero-Halogen Lead-Free Ultra-Low-Temp Solder Paste 5RG |
For special applications requiring ultra-low soldering temperature; | 0ppm ROL0 |
Rosin Type | Alloy powder options: In52Sn48/In40.2Sn20.7Bi39.1 T5, T6, T7 |
| Zero-Halogen Water-Wash Lead-Free High-Temp Solder Paste 8MWTH/5RWTH |
Ideal for high-cleanliness high-temperature applications, fully cleanable with water for faster cleaning. Zero halogen (0.00%), eco-friendly and biodegradable to reduce wastewater treatment costs. Excellent cold and hot slump resistance under high temperature & humidity to prevent bridging. Viscosity remains stable during prolonged printing; | 0ppm ORL0 |
Water-Wash Type | Alloy powder options: 0307/105/305 T3, T4, T5 |
| Zero-Halogen Water-Wash Lead-Free Medium-Temp & Low-Temp Solder Paste 8MWTH/2RWTH |
Ideal for high-cleanliness medium and low-temperature applications, fully cleanable with water for faster cleaning. Zero halogen (0.00%), eco-friendly and biodegradable to reduce wastewater treatment costs. Excellent cold and hot slump resistance under high temperature & humidity to prevent bridging. Viscosity remains stable during prolonged printing; | 0ppm ORL0 |
Water-Wash Type | Alloy powder options: Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58/Sn42Bi57Ag1/Sn49.6Bi48.5Ag1Cu0.9/high-reliability LT32S/In52Sn48/In40.2Sn20.7Bi39.1 T2.5, T3, T4, T5 |
| Water-Wash Lead-Free High-Temp Solder Paste 8MW1P/5RW1 |
Water-cleanable post-soldering residues, low material cost; | ORH1 | Water-Wash Type | Alloy powder options: SC07/0307/105/305 T3, T4 |
| Water-Wash Lead-Free Low-Temp Solder Paste 8MW1AP/5RW1A |
Leaves no residual marks after soldering on nickel-plated aluminum heat sink fins; low cost; | ORH1 | Water-Wash Type | Alloy powder options: Sn42Bi58 T2.5, T3, T4 |
| Water-Wash Lead-Free Low-Temp Solder Paste 8MW3/2RW3 |
Designed for copper tube embedded aluminum cold plates, features good spreadability, low voiding and easy water cleaning; | ORL1 | Water-Wash Type | Alloy powder options: Sn42Bi58 T2.5, T3, T4 |
| Hot Bar Lead-Free High-Temp Solder Paste 5ROHT/5RTZT |
Formulated for hot bar soldering. Residues will not blacken after soldering at 400°C and can be wiped off easily. Superior performance with zero solder balls. Compatible with pneumatic valves, screw valves and jet valves for dispensing; | ROL0 | Rosin Type | Alloy powder options: 0307/105/305/00507BN/00507B2N T3, T4, T5, T6, T7 |
| Laser Lead-Free High-Temp Solder Paste 5RLJ |
For laser reflow soldering, superior performance with no solder balls. Compatible with pneumatic, screw and jet valve dispensing. | <500ppm ROL0 |
Rosin Type | Alloy powder options: 0307/105/305/00507BN/00507B2N T3, T4, T5, T6, T7 |
| Laser Lead-Free Medium & Low-Temp Solder Paste 5RLJB |
For laser reflow soldering, superior performance with no solder balls. Compatible with pneumatic, screw and jet valve dispensing. | <500ppm ROL0 |
Rosin Type | Alloy powder options: Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58/Sn42Bi57Ag1/Sn49.6Bi48.5Ag1Cu0.9/high-reliability LT32 and LT32S T3, T4, T5, T6, T7 |
| Lead-Free Solder Paste for Stainless Steel 8MW5S/5RW5S |
Direct soldering on stainless steel substrates; fully cleanable with water; | ORH1 | Water-Wash Type | Alloy powder options: SC07/0307/105/305/Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58 T3, T4 |
| Lead-Free Solder Paste for Aluminum 8MW5A/5RW5A |
Direct soldering on aluminum substrates; fully cleanable with water; | ORH1 | Water-Wash Type | Alloy powder options: SC07/0307/105/305/Sn64Bi35Ag1/Sn64.7Bi35Ag0.3/Sn42Bi58 T3, T4 |
Select the appropriate solder powder particle size based on your process requirements and product type
| Lead-Free Solder Paste Alloy Type | Melting Point (°C) | Soldering Temp. (°C) | T2.5 | T3 | T4 | T4.5 | T5 | T6 | T7 |
|---|---|---|---|---|---|---|---|---|---|
| Sn96Ag4 | 221-226 | 240-260 | ✔ | ✔ | ✔ | ||||
| Sn97Ag3 | 221-224 | 240-260 | ✔ | ✔ | ✔ | ||||
| 305（Sn96.5Ag3Cu0.5） | 217 | 235-255 | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | |
| 105（Sn98.5Ag1Cu0.5） | 221-227 | 240-260 | ✔ | ✔ | |||||
| 0307（Sn99Ag0.3Cu0.7） | 221-227 | 240-260 | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | |
| 0107（Sn99.2Ag0.1Cu0.7） | 221-227 | 240-260 | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | |
| 00507BN（SnCu0.7Ag0.05BiNi） | 221-227 | 240-260 | ✔ | ✔ | |||||
| 00507B2N（SnCu0.7Ag0.05Bi2Ni） | 221-227 | 240-260 | ✔ | ✔ | |||||
| 99307（Sn99.3Cu0.7） | 221-227 | 240-260 | ✔ | ✔ | |||||
| SC07NG（Sn99.3Cu0.7 (Ni0.04-0.07, Ge0.008-0.01)） | 227 | 240-260 | ✔ | ✔ | |||||
| Sn90Sb10 | 253.3-255.7 | 275-290 | ✔ | ✔ | ✔ | ✔ | |||
| Sn95Sb5 | 245 | 265-285 | ✔ | ✔ | ✔ | ✔ | |||
| Sn69.5Bi30Cu0.5 | 149-186 | 205-225 | ✔ | ✔ | |||||
| 64351（Sn64Bi35Ag1） | 151-172 | 195-220 | ✔ | ✔ | ✔ | ✔ | ✔ | ||
| 6473503（Sn64.7Bi35Ag0.3） | 151-172 | 195-220 | ✔ | ✔ | |||||
| 4258（Sn42Bi58） | 138 | 160-185 | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | |
| Sn42Bi57Ag1 | 139/140 | 160-185 | ✔ | ✔ | ✔ | ✔ | ✔ | ||
| High-Reliability Lead-Free Low-Temp LT32/LT32S | 143-144 | 160-190 | ✔ | ✔ | ✔ | ✔ | ✔ | ✔ | |
| In52Sn48 | 118 | 140-160 | ✔ | ✔ | ✔ | ||||
| In40.2Sn20.7Bi39.1 | 65-89 | 110-130 | ✔ | ✔ | ✔ |
