Collecting a complete range of solder paste, solder wire and solder rods, providing welding materials suitable for various SMT scenarios
Sn99Ag0.3Cu0.7 low-silver formula offers excellent value with strong oxidation resistance, meeting international standards such as JIS and IPC.
Suited to dip soldering and wave soldering of circuit boards, and to electronics assembly processes that require higher soldering temperatures.
Sn96.5Ag3.0Cu0.5 (SAC305) alloy system with strong oxidation resistance, meeting international standards such as JIS and IPC.
Sn99.3Cu0.7 (same system as SN100C), a classic lead-free alloy offering excellent value with strong oxidation resistance.
Mass wave soldering of PCB boards with long hours in the solder pot (the core scenario); the pot stays hot for long periods without easy oxidation or dross formation.
Made from pure tin and pure silver with impurities minimized; the high silver content improves joint strength and luster.
Made from pure tin, pure silver and pure copper with impurities minimized; it flows well in dip soldering with low dross and excellent wetting and spread.
