SMT Solder Paste Manufacturers.
From solder paste selection to mass-production process debugging, from print clogging to reflow voids, we provide end-to-end actionable technical solutions to raise your yield and lower your cost.
Fully traceable · Guaranteed delivery
They all use JJY products and technical services
We don't just sell solder paste — we help you stabilize your process, raise your yield and optimize your cost
Based on your package type (01005 fine pitch / QFN / BGA / flip chip), board material (FR-4 / aluminum / high-frequency board) and process requirements, and drawing on thousands of industry cases, we help you match the most suitable alloy system and flux activity level, avoiding batch defects caused by improper selection.
SAC305 / Low-Silver / High-Temp / Halogen-Free
Viscosity / Particle Size / Activity Level Advice
Small-batch testing + technical follow-up
For the four key processes — printing parameters, stencil aperture design, reflow zone configuration and placement accuracy — the JJY engineering team intervenes on-site or remotely, providing a quantifiable process window to lock in parameters and stabilize yield.
Full-parameter optimization of squeegee pressure / stencil thickness / warm-up time / print speed
Four-stage zone calibration (preheat / soak / reflow / cooling) with furnace temperature test report
Oxygen-content threshold advice + comprehensive calculation of actual cost vs yield improvement
For special substrates, extreme processes and compliance certifications, we provide full-process custom development from alloy formula → flux system → mass-production validation.
We test key metrics and verify consistency for your incoming solder material batches, catching deviations early to prevent mass production incidents.
For persistent line issues such as clogged apertures, insufficient solder, bridging, tombstoning, voids, poor wetting and solder joint cracking, we structurally pinpoint root causes and deliver actionable CAPA.
We provide systematic training for your process engineers, SMT operators and quality staff to raise your team's process expertise.
So that every request is handled professionally, promptly and traceably
1-on-1 engineer engagement, clarifying the scenario, problem and acceptance criteria within 30 minutes
A quantifiable solution delivered within 24h, including parameter recommendations, validation methods and acceptance criteria
Dual modes of remote guidance and on-site support, following through mass-production validation with real-time adjustments
Regular follow-up visits once stable, with service reports and continuous process optimization recommendations
All case data is published with client authorization
A well-known consumer electronics client had a BGA reflow void rate of 8~12% on 0.4mm pitch smartphone mainboards, far exceeding IPC standards and becoming a bottleneck for mass shipment.
Mismatched flux activity + insufficient cooling-zone slope
Adjusted flux activity + optimized reflow zones (longer preheat, faster cooling)
BGA void rate stabilized under 2%, yield improved from 92.5% to 99.6%
An automotive Tier1 client had a solder joint DPPM of up to 800 on QFN products.
By re-matching the activity level and optimizing the stencil aperture design (0.1mm inset), DPPM dropped below 30 and passed automotive-grade certification.
A new-energy BMS client suffered severe print clogging on 01005 packages.
By adjusting the powder particle size distribution and optimizing the stencil electropolishing process, print yield rose from 87% to a stable 99.8%, greatly improving equipment utilization.
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Technical Datasheets · SMT Process Guides · ROHS/REACH Certificates · Product Catalogs · Selection Comparison Tables
Solder Paste Selection · Print Defects · Reflow Process · Storage & Use · Failure Troubleshooting · Environmental Compliance
Tell us about your production conditions, and JJY Tinsolder will match you with the right soldering solution.