Collecting a complete range of solder paste, solder wire and solder rods, providing welding materials suitable for various SMT scenarios
Uses the Sn45Pb55 alloy system with a wide melting range, excellent wettability and bright joints; suited to general soldering in home appliances and consumer electronics.
High-activity flux contains penetrating agents that quickly break through dense Ni/Cr oxide layers, solving the difficult soldering of nickel-chrome plated parts.
Solid core with no rosin; pure Sn63Pb37 eutectic alloy solder wire, suited to applications where flux must be added separately or to special processes (dedicated for tinning, dip soldering and wave soldering).
Minimal, clear post-solder residue with low ionic contamination and high insulation resistance; ideal for no-clean high-end electronics processes.
High-activity flux contains penetrating agents that allow direct soldering of 304/316 stainless steel without pickling or copper-plating pretreatment; just degrease with alcohol before soldering.
Uses the Sn55Pb45 alloy system with a melting point of 183~203℃ and excellent wettability; leaves little residue and minimal smoke, suitable for general electronics soldering of copper parts, tinned copper parts and the like.
Uses a fluoride-organic acid composite film-removal system that breaks through the Al₂O₃ oxide film, allowing direct soldering of aluminum alloys such as 6061/5052/3003/1060, and supports copper-aluminum brazing.
