Application Features
- Suited to miniature precision components, with uniform joints and no bridging
- Compatible with FPC flexible boards, resisting cracking and detachment under bending
- Low thermal stress that protects precision medical sensor chips
- Extremely low impurity residue, meeting medical cleanliness standards
Industry Challenges
High-density micro devices, micro pads are prone to solder bridging and cold solder joints
FPC flexible boards undergo repeated bending, solder joints are prone to fracture failure
Large number of thermal sensors, high temperatures easily damage precision components
Medical high-reliability standards impose strict controls on residues and voids
Core Advantages
Precision Forming of Micro Solder Joints
Suitable for ultra-fine pitch and micro device soldering, with controllable printing and forming, effectively suppressing bridging and insufficient solder, meeting high-density PCB assembly requirements for medical equipment.
Bending and Fatigue Resistance
Solder joints have excellent toughness, suitable for repeated bending of FPC flexible boards, reducing the risk of solder joint cracking and detachment under dynamic operating conditions of wearable devices.
Low Thermal Stress Device Protection
Alloy formulations are available in high and low temperature systems, reducing thermal damage to thermal sensors and MEMS chips, suitable for precision components in monitoring and imaging applications.
Low Voids and Low Ionic Residue
High-purity Flux with controllable void rate and low ionic residue, reducing electrochemical corrosion, meeting medical Class?3 high-reliability soldering requirements.
Excellent Signal Integrity
Stable solder joint structure with minimal impedance fluctuation, ensuring stable high-frequency signal acquisition for color ultrasound and patient monitors, avoiding abnormal data collection.
Batch Traceability Control
High-purity alloy raw materials with full-process composition testing, complete traceability for each batch, meeting compliance and documentation traceability requirements for medical devices.
Product Adaptation Solutions
Solder Paste · SMT Reflow Soldering
For patient monitors, color ultrasound, surgical robot main control boards, and wearable FPC SMT; fine pitch, BGA/QFN soldering, high and low temperature solder paste options available, controllable voids, suitable for various medical reflow profiles.
Solder Bar · Wave Soldering/Dip Soldering
For wave soldering of power boards and interface plug-in boards in medical equipment; high purity with low impurities, stable solder surface, uniform wetting, suitable for medium and large batch production of medical board plug-ins.
Solder Wire · Hand Soldering/Rework
For R&D prototype debugging, prototype rework, connector touch-up soldering; low spatter, low residue, suitable for repair and small-batch prototyping of surgical and monitoring equipment.
Application Coverage
Patient Monitor
Signal Acquisition Board / Power Board / Module Board
Color Ultrasound
Ultrasound Probe Board / Image Processing Board
Surgical Robot
Main Control Unit / Servo Control Board / Sensor Board
Wearable Medical Device
ECG Patch / Blood Oxygen Wristband / FPC Flexible Board
Typical Process Scenarios
SMT Reflow Soldering
High-density medical main board SMT, precision soldering of BGA, QFN, and micro 01005 components, low voids and high yield
Wave Soldering/Selective Wave Soldering
Soldering of medical plug-in boards and connector pins, full solder penetration, reducing the risk of cold and missed solder joints
Hand Soldering/Rework
Prototype R&D debugging, production line touch-up soldering, after-sales repair of medical equipment, low residue and easy cleaning
Quality Assurance
Jia Jinyuan medical electronic dedicated solder paste, solder bars, and solder wires comply with the IPC?J?STD?006C medical-grade solder standard, and meet RoHS and REACH environmental requirements. High-purity alloy raw materials, strict impurity control, full-process testing, complete batch traceability, and low ionic residue meet the high-reliability assembly and production requirements for patient monitors, color ultrasound, surgical robots, and wearable devices.
