Application Features
- Vibration-resistant and heat-resistant, joints remain solid without cracking
- Low voiding with high thermal conductivity, suited to high-current applications
- Oxidation-resistant with minimal residue, stable printing definition
- Highly process-compatible, suited to continuous large-volume production
Industry Pain Points
Long-term equipment vibration leads to fatigue cracking of solder joints
High-power devices generate heat, and voids cause overheating failure
Temperature fluctuations and humidity in industrial control sites make solder joints prone to oxidation and corrosion
24-hour continuous production leads to large amounts of solder dross and high loss
Core Advantages
Vibration and Fatigue Resistant Solder Joints
Suitable for vibration, impact, and alternating high-low temperature working conditions. Solder joints are strong and impact-resistant, reducing cold solder joint cracking and lowering equipment failure rates.
High Power, Low Void, High Current Carrying Capacity
Suitable for soldering thick copper boards and power devices. Solder joints are dense with low voids, providing stable electrical and thermal conductivity to meet high-current, high-load usage requirements.
Industrial Grade Oxidation Resistance, Mass Production Compatible
Enhanced oxidation-resistant formula ensures stable Solder Paste printing, low dross generation in solder pots, and compatibility with 24/7 large-scale production for industrial control applications.
Wide Temperature Range Wetting Compatibility
Compatible with mixed SMT and through-hole component boards, suitable for both Reflow Soldering and wave soldering. Reduces solder bridging and cold solder joints, improving soldering yield.
Corrosion Resistant, Long Service Life
High solder joint density withstands humid, dusty, and salt spray environments, ensuring reliable long-term connection for industrial control equipment.
Batch Consistency Control
Full-process closed-loop testing ensures stable alloy composition, minimal batch variation, and compatibility with long-term mass supply for industrial control products.
Product Compatibility Solutions
Solder Paste · SMT Reflow Soldering
Used for SMT placement on PLC, servo, and inverter motherboards. Stable printing and forming, controllable BGA/QFN voids, compatible with various reflow process profiles.
Solder Bar · Wave Soldering/Dip Soldering
Used for wave soldering and dip soldering on industrial control through-hole boards. Low dross, low copper corrosion, excellent wetting and solder penetration, suitable for large-volume continuous production replenishment.
Solder Wire · Manual Soldering/Repair
Used for R&D prototyping, production line touch-up soldering, and after-sales rework. Fast wetting, low spatter, minimal residue, suitable for soldering terminals and power modules.
Application Coverage
PLC Controllers
Main Control Board / IO Module / Communication Module
Industrial Robots
Control Cabinet / Servo Board / Teach Pendant
Servo Drives
Power Board / Control Board / Encoder
Inverters
Drive Board / Power Board / Inverter Module
Typical Process Scenarios
SMT Reflow Soldering
Main control board SMT production, stable soldering of fine-pitch ICs, BGA, QFN, with controllable void rate
Wave Soldering/Selective Wave Soldering
Full solder penetration for through-hole terminals, connectors, and power pins, suitable for large-volume mixed component boards
Manual Soldering/Rework
R&D prototyping, production line touch-up soldering, after-sales repair, fast wetting, low spatter, smooth operation
Quality Assurance
All JJY industrial control dedicated solder paste, solder bar, and solder wire products strictly comply with the IPC-J-STD-006C industrial grade standard, and have passed the full set of EU RoHS and REACH environmental certifications. With a 5000㎡ standardized production base, 96 professional production devices, and full-process ISO system control. A closed-loop quality control system is established from raw material screening, precise alloy proportioning, automated melting, multiple finished product inspections to outbound delivery. Each batch of products is traceable. Solder Joint Strength, oxidation resistance, and thermal shock resistance all meet the stringent requirements of industrial equipment, with stable and consistent batch performance, compatible with the mass production needs of industrial control equipment for high reliability, long service life, and low failure rate.
