Application Features
- Ultra-fine powder formula that suppresses bridging and short circuits
- Excellent heat dissipation that slows lumen depreciation and reduces dead LEDs
- Suited to high-heat-capacity substrates, reducing cold joints
- Reduces chip thermal shock, compatible with multiple substrates
Industry Challenges
Mini/MicroLED micro-pads are highly prone to bridging and short circuits caused by insufficient solder.
High-power modules face severe thermal dissipation pressure; high void content accelerates luminous decay and dead LEDs.
Aluminum PCBs have high thermal capacity, which easily leads to poor wetting and cold solder joints.
Mass transfer mounting for display backlighting requires high yield and stability in mass production.
Core Advantages
Ultra-fine Particle Precision Printing
Compatible with Mini/MicroLED micro-pads, it resists slumping, suppresses bridging, and supports mass pixel mounting production.
Low Voiding, High Thermal Conductivity
Controllable void content, excellent thermal conductivity, quickly dissipates chip heat, delays LED luminous decay, and reduces the risk of dead LEDs.
Excellent Wetting on Aluminum PCBs
Formula optimized for the high thermal capacity of aluminum PCBs, it removes pad oxidation, ensures full solder coverage, and reduces cold and missed solder joints.
Wide Reflow Process Window
Compatible with direct-lit backlighting and high-power luminaires, it reduces thermal shock to LED chips and is compatible with various PCB surface finishes.
Low Residue, High Insulation
Low Flux residue with good insulation performance prevents leakage between micro-pixels and ensures stable display performance.
Stable Mass Production
Consistent printing performance with minimal batch-to-batch variation, suitable for large-scale manufacturing of backlight modules and lighting fixtures.
Product Compatibility Solutions
Solder Paste · SMT Reflow Soldering
For MiniLED, MicroLED, and direct-lit backlight board mounting; ultra-fine powder solder paste with low voiding, compatible with high-density pixel arrays and aluminum PCBs.
Solder Bar · Wave Soldering / Dip Soldering
For through-hole soldering of lighting driver boards and power boards; pure solder with uniform wetting, suitable for high-volume through-hole production of luminaires.
Solder Wire · Hand Soldering / Repair
For LED prototype debugging and rework of lighting boards; low spatter, suitable for repair work on backlight modules and high-power luminaires.
Application Coverage
MiniLED
Display Backplane / COB Module Board
MicroLED
Micro-pixel Array Board / Display Substrate
Direct-lit Backlighting
TV Backlight Board / Backlight Driver Board
High-power Lighting
Aluminum PCB Lighting Board / Outdoor Luminaire Board
Typical Process Scenarios
SMT Reflow Soldering
High-density mounting for Mini/MicroLED, precision printing on micro-pads, low-void high-thermal-conductivity soldering
Wave Soldering / Selective Wave Soldering
Through-hole soldering of LED driver power boards, full solder penetration, reducing cold solder defects
Hand Soldering / Rework
Debugging and touch-up soldering for backlight modules and lighting boards, low residue and easy to operate
Quality Assurance
JIAJINYUAN LED lighting-specific solder paste, solder bars, and solder wires comply with IPC?J?STD?006C standards and meet RoHS environmental requirements. Ultra-fine particle options are available, with low voiding and high thermal conductivity, suitable for high-volume production and assembly of MiniLED, MicroLED, direct-lit backlighting, and high-power lighting fixtures.
