When switching to Solder Paste of a different brand, it is common to experience printing defects such as skipping or slumping during the printing process.

This is usually caused by the inconsistency in viscosity and thixotropy between the new solder paste and the original one.

Adjust printing parameters, such as squeegee pressure and speed, while testing the printability of the solder paste.

Ensure thorough stirring and temperature recovery before each solder paste change.

During use, solder paste tends to form spherical solder joints, which is mostly caused by insufficient activity of the solder paste.

Solder paste formulations vary significantly between brands, so the reflow profile needs to be adjusted according to the actual soldering conditions.

Maintain a stable storage environment temperature for solder paste to avoid the impact of high or low temperatures on its performance.

Extended storage after opening can cause oxidation of the solder paste, affecting soldering quality.

Seal it after each use and use it up within the specified time.

If blackened solder joints or residues are found during solder paste use, it may be related to the Flux composition of the solder paste.

Select the appropriate flux type and clean the printing equipment regularly.

Cold solder joints during Reflow Soldering may be caused by insufficient solder paste volume or improper soldering temperature settings.

Check whether the solder paste printing thickness meets the standard and ensure a reasonable reflow temperature profile.

Clumping of solder paste during use indicates that the storage conditions do not meet the requirements.

Prevent solder paste from getting damp or being exposed to air for too long.

Edge slumping after solder paste printing may be due to poor flowability of the solder paste.

Select a solder paste model suitable for the current process and optimize printing parameters.

Bridging after soldering may be caused by excessive solder paste volume or low printing accuracy.

Control the solder paste volume and improve printing accuracy.

Splattering during solder paste use may be due to low viscosity of the solder paste.

Select solder paste with appropriate viscosity and adjust printing parameters.