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Here you can find knowledge about Void Reduction, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
When soldering BGA devices on thick copper boards, due to the large heat capacity and slow heating rate, the flux in the solder paste does not volatilize sufficiently and gas escape is hindered, making it extremely easy to form void defects inside solder joints. It is necessary to select a special solder paste with low residue, high activity, and a wide reflow window; otherwise, the void rate generally exceeds 25%, far exceeding the requirement of ≤15% for IPC-A-610 Class G.
Published: 2020-12-08Voids can easily cause fatal defects such as cold solder joints, bridging, and BGA cracking in the SMT process of new energy, medical, and communication electronic products. Production line data from Jia Jinyuan shows that the failure rate of BGA devices with a void rate exceeding 8% increases by 3.2 times. Closed-loop control must be achieved through stencil aperture optimization, dynamic calibration of squeegee pressure, and real-time monitoring of nitrogen purity.
Published: 2020-10-04The head-in-pillow effect caused by solder paste defects and X-ray void defects in BGA soldering require coordinated troubleshooting from four aspects: solder paste selection, stencil design, printing parameters, and reflow profile. Insufficient wetting, uneven flux volatilization, or pad oxidation during the solder paste soldering process will exacerbate solder paste defect manifestations. Combining X-Ray image features can quickly identify the root cause of voids.
Published: 2019-12-14Void X-Ray inspection identifies the internal void distribution of solder joints through high-precision imaging, and quantifies the void rate using an area ratio algorithm. When the void rate exceeds the 5% threshold specified in IPC-A-610, it is judged as non-conforming. This method has been batch-verified on the Jiajinyuan production line, significantly reducing the missed detection rate of BGA cold solder joints.
Published: 2018-07-15In the tin dipping process, the tin dipping time is a key parameter determining the thickness of the terminal tin layer. Excessively long dipping time will lead to an overly thick tin layer, which is prone to oxidation, poor soldering, and abnormal insertion/extraction force. Actual measurements on Jia Jinyuan's production line show that for every 0.5-second increase in tin dipping time, the average tin thickness increases by 8–12 μm. Comprehensive control must be implemented in combination with the base material, tin bath temperature, and flux activity.
Published: 2017-10-14The solder used in energy storage modules is extremely sensitive to voiding rate. Low-void solder paste can control the voiding rate of BGA solder joints within 5%, significantly improving the thermal fatigue life of electronic control boards under high-power cycling. Jiajinyuan JY-810A solder paste, with its stable thixotropy, low residue, and reflow wetting angle of less than 25°, has become a practical combination for BGA soldering of electronic control boards in the selection of solder materials for energy storage modules.
Published: 2017-04-04SMT placement pressure control directly affects the deformation state of solder paste. Excessive pressure will cause the solder paste to be squeezed laterally to both sides of the pad, leading to bridging defects. JIAJINYUAN placement machines achieve ±0.02N precision control through real-time pressure feedback and Z-axis dynamic compensation, combined with stencil aperture design matched with the rheological properties of solder paste, to suppress bridging from the source.
Published: 2017-03-09Adjusting solder paste process parameters under a nitrogen reflow environment can significantly reduce the solder paste void rate. It is necessary to simultaneously optimize the heating slope, peak temperature and atmospheric oxygen content of reflow soldering, and combine stencil aperture design with squeegee pressure to control printing accuracy, so as to avoid cold solder joints and poor wetting caused by uneven nitrogen displacement or hindered flux volatilization.
Published: 2016-08-11Excessive solder paste voiding rate of the thermal pad at the bottom of QFN is a high-frequency failure on SMT production lines, requiring coordinated optimization from four aspects: solder paste selection, stencil aperture design, printing parameters, and reflow profile. Although low-void solder paste can reduce the voiding rate, it cannot replace process matching. The squeegee pressure and speed, nitrogen purity, and temperature gradient of each reflow zone must be adjusted in accordance with the actual equipment status of the production line.
Published: 2016-03-21High-frequency board welding imposes extremely high requirements on the thermal sensitivity of the substrate. Materials such as PTFE and ceramic-filled PP generally have a glass transition temperature below 170°C. If the peak reflow temperature exceeds 260°C, it can easily cause delamination, blistering, or dielectric constant drift. Actual measurements on Jiajinyuan's production line show that 255°C is the safe threshold for most high-frequency board welding. Thermal damage must be avoided through stepwise heating, reducing residence time in the high-temperature zone, and nitrogen atmosphere control.
Published: 2015-10-08Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.