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Here you can find knowledge about Void Reduction, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
BGA soldering quality is highly dependent on the rheological properties and reflow behavior of solder paste. Low-void solder paste, by optimizing metal content, flux activity and particle distribution, significantly reduces solder joint void rate to below 3% in actual production lines, and has become a core material for improving BGA soldering first-pass yield and long-term reliability.
Published: 2014-12-05SMT defects are a high-frequency source of failures on production lines. Typical issues such as solder balls, voids, tombstoning, and bridging are directly related to printing accuracy, reflow profile, and component coplanarity. Jia Jinyuan production line data shows that 83% of SMT defects stem from solder paste volume deviation exceeding ±15% or improper matching between stencil apertures and PADs.
Published: 2014-09-14In circuit board soldering, cold solder joints, solder beads, and voids are high-frequency defects on production lines, directly affecting first-pass yield and long-term reliability. Based on 20 years of practical data from the Jiajinyuan SMT production line, this paper focuses on key intervention points such as solder paste printing accuracy, dynamic matching of reflow profiles, stencil aperture optimization, and nitrogen concentration gradient control, and provides immediately implementable parameter adjustment combinations and failure reproduction verification methods.
Published: 2014-05-14Consumer electronics solder faces the dual challenges of solder bead residue and high solder joint void rate in SMT production lines. Jiajinyuan low-solder-bead low-void consumer electronics solder optimizes the metal powder particle size distribution and flux activity ratio, reducing the number of post-soldering solder beads for 0201 components to ≤3 per square centimeter and stably controlling the BGA solder joint void rate at ≤8%, significantly improving the first-pass yield of consumer electronics solder on high-density PCBs.
Published: 2014-03-19Excessive voiding in the bottom thermal pad during QFN soldering is a high-frequency failure point in production lines, rooted in improper solder paste volume control. Jia Jinyuan SG-880 series solder paste, used with a 0.15mm stencil aperture and 25℃ environmental temperature control, can reduce the void rate to below 8%. This solution has been continuously verified on the mass production line of automotive MCU modules for 6 months.
Published: 2013-07-18High-frequency board welding is extremely sensitive to solder paste voiding rate. Dielectric parameter fluctuations caused by voids directly degrade signal integrity. Jiajinyuan low-void solder paste, by optimizing metal content, flux volatilization gradient and reflow wetting dynamics, stably controls the voiding rate of BGA solder joints within 3.2% in 5G RF module tests, significantly suppressing insertion loss drift in high frequency bands.
Published: 2013-05-22When soldering BGA/QFN chips via SMT, an excessive void rate can lead to cold solder joints, increased thermal resistance, and early failure, and low-void solder paste is the core solution to this problem. The void rate of Jiajinyuan JL-808 series solder paste is stably controlled below 8% in mass production. Combined with optimized stencil aperture design and nitrogen-protected reflow, it can reduce the void rate at the bottom of QFN packages from 25% to 6.3%, while the void rate of individual BGA balls is simultaneously reduced to 4.1%.
Published: 2013-03-25Voiding directly affects solder joint reliability in SMT soldering. Its main causes include insufficient volatilization of solder paste flux, pad oxidation, and improper reflow heating ramp-up, which often interact with each other in actual production lines. Jiajinyuan solder paste shows variations in void rate under different stencil aperture designs and reflow profile matching, requiring coordinated optimization across printing, storage, and reflow profile stages.
Published: 2013-02-08First Article Inspection is a critical line of defense for intercepting material mix-ups and abnormal process parameters on SMT production lines. By verifying before mass production whether key elements such as component models, stencil apertures, solder paste batches, placement coordinates, and reflow profiles are matched, it can prevent batch rework of entire PCBA lots caused by reversed component polarity, package confusion, pad design deviations, or temperature out-of-control. Production line data from Jia Jinyuan shows that after strictly implementing First Article Inspection, material mix-up related defects decreased by 92%, and cold solder joint opens caused by incorrect process parameter settings were reduced by 87%.
Published: 2012-02-08Excess solder causes excessive solder paste on the bottom pads of BGA packages, which not only leads to surface defects such as solder ball splashing and bridging, but more importantly, significantly increases the probability of void formation. Especially in large-sized BGA devices, the void rate may exceed the 25% acceptable threshold specified in IPC-A-610E. Jiajinyuan's measured data shows that for every 0.02mm the solder paste thickness exceeds the standard value of 0.13mm, the average void area ratio increases by 7.3%. The root cause is that excessive solder paste obstructs the escape channels for flux gas during the reflow phase.
Published: 2011-10-10Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.