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Here you can find knowledge about Void Reduction, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
During dip soldering, temperature runaway in manual dip soldering pots is the main cause of cold solder joints and missed solder joints. For the JiajinYuan manual dip soldering pot, the solder bath temperature must be stably controlled at 255℃±3℃, the preheating zone maintained at 90℃~110℃, and the dip soldering time strictly limited to 3 seconds±0.5 seconds. Imbalance in the coordination of these three factors will cause bridging or poor wetting.
Published: 2023-06-14Introducing high-purity nitrogen into the reflow oven can significantly inhibit the oxidation reaction of solder joints, maintain a reducing atmosphere for the solder paste during the melting stage, and thereby reduce the void rate of solder joints for BGA and QFN devices. This effect is particularly prominent for the combination of PCBs with OSP surface finish and lead-free solder paste. Actual measurements from Jia Jinyuan reflow ovens show that the void area ratio decreased from 8.7% to 2.3%. The nitrogen flow rate should be stably controlled at 15–25 L/min, accompanied by verification of the furnace chamber sealing performance.
Published: 2023-01-08Nitrogen reflow in BGA/QFN precision soldering suppresses oxidation, improves wettability, and optimizes the flowability of molten metal, stably reducing the void rate from 18%~25% under air reflow to 4.2%~6.8%. The measured purity of the Jiajinyuan nitrogen generator reaches 99.999%, with a dew point ≤ -60℃. Combined with precise flow control (15~25L/min) and real-time monitoring of furnace oxygen concentration (≤100ppm), it can directly reuse existing reflow oven hardware to complete production line upgrades.
Published: 2022-09-19Unreasonable reflow soldering temperature curve settings will significantly aggravate typical defects such as voids and solder balls. Excessively fast preheating ramp-up causes the flux to boil violently and splatter, forming solder balls. Insufficient soaking or low peak temperature leads to poor solder wetting and hinders gas escape, inducing voids. Actual measurements on Jiajinyuan production lines show that when the ramp rate exceeds 3℃/s or the reflow time is less than 60 seconds, the BGA void rate generally rises above 15%.
Published: 2022-06-27Leveraging its solder ODM R&D capabilities, Jia Jinyuan has developed a customized solder system featuring a low void rate (≤3%), a reflow peak temperature ≤220°C, and an extended oxidation resistance lifespan of over 72 hours, addressing pain points such as excessive void rate in BGA packaging, low-temperature soldering requirements for temperature-sensitive devices, and printing defects caused by solder paste oxidation on production lines. This system has been batch-validated on the production lines of multiple automotive electronics and medical equipment customers.
Published: 2022-03-17BGA voiding is a typical SMT defect that directly affects device heat conduction and solder joint reliability. Production line data from Jiajinyuan shows that a void rate exceeding 25% triggers batch rework. Based on real retrospective cases, this paper conducts a two-way investigation from four key dimensions: solder paste activity degradation, deviations in stencil aperture design, peak temperature fluctuations in the reflow profile, and insufficient nitrogen purity, clarifying the coupling relationship between material batch anomalies and printing parameter drift.
Published: 2021-11-03
For BGA high-density packaging scenarios, Jiajinyuan's halogen-free, low-void solder paste 8M9P/5RR series has completed production line verification at leading packaging and testing customers. The measured void rate is stably controlled within 3%. After reflow soldering, the solder joints exhibit uniform wetting and a dense, continuous IMC layer, raising the first-pass yield of BGA devices from 92.7%
Published: 2021-07-14The control of the dwell time of the OSP board welding production line is directly related to the chemical stability and solderability of the OSP film layer. If the exposure time of the PCB from the spray OSP treatment to before reflow soldering exceeds 48 hours, or if it stays in a high-temperature and high-humidity environment (such as RH > 60%, T > 25°C) for more than 24 hours, the film layer is prone to hydrolysis and oxidation, which will cause the solder joint void rate to increase by more than 12% and the wetting angle to increase to more than 45°. Actual measurements on the Jiajinyuan production line show that this problem accounts for 67% of the solder bridging defects in OSP board welding.
Published: 2021-07-09AOI inspection is highly efficient for identifying surface defects on solder joints, but due to the limitations of optical principles, it cannot penetrate the metal solder layer, resulting in complete missed detection of internal defects such as voids and cold solder joints. X Ray inspection, with its penetrating capability, has become the only reliable means to identify solder joint voids in devices such as BGA and QFN.
Published: 2021-02-13When soldering 5G devices on high-frequency PCBs, solder faces the practical issue of increased void rate that exacerbates signal attenuation. By optimizing metal content, rheological properties, and flux volatilization pathways, low-void solder paste has been verified on actual production lines of the Jiajinyuan JH-5G series, stably controlling the void rate of BGA solder joints within 8%, significantly improving the impedance continuity and return loss performance of RF modules in the millimeter-wave frequency band.
Published: 2021-01-19Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.