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Published: 2026-05-12Internal voids in BGA/QFN solder joints will significantly weaken electrical and thermal conductivity. Especially when the void area ratio exceeds 25%, the thermal resistance of the solder joint rises by more than 30%, and the current carrying capacity decreases significantly. When X-ray inspection in the production line finds that voids are concentrated in the center of the pad or the edge area of the chip, it is necessary to immediately investigate key factors such as solder paste printing offset, excessive oxygen content in the reflow atmosphere, and oxidation of the PCB pad.
Published: 2025-12-06Void-free nitrogen reflow combined with low-void solder paste can reduce the void ratio of BGA solder joints from 15% to below 3%. This combination has been stably running on Jia Jinyuan's production line for over 2 million units. The key is that nitrogen purity must be maintained above 99.995% with oxygen content below 50 ppm. Combined with the thixotropy optimization and activator gradient volatilization design of Jia Jinyuan LDS-702 low-void solder paste, voids are effectively suppressed in the early stage of reflow.
Published: 2025-05-26Solder sample testing should focus on four practical dimensions: printing accuracy, wetting and spreading capability, void rate control, and solder ball formation tendency. Through methods such as stencil aperture matching verification, post-reflow solder joint morphology observation, X-ray void area statistics, and solder ball counting under a microscope, the adaptation boundaries of Jia Jinyuan solder under different PCB pad designs and process windows can be quickly identified.
Published: 2025-05-15During the soldering rework of gold-plated boards, the gold layer is prone to oxidation by high temperatures or loss due to mechanical scraping, which leads to exposure of the nickel layer on the pad surface, poor wetting, and increased cold solder joints, directly affecting the long-term reliability of gold-plated board soldering. It is necessary to implement coordinated control from three aspects: soldering iron temperature, dwell time, and cleaning method.
Published: 2025-03-09
The voids in solder joints formed by bar solder wave soldering are closely related to the material properties of the solder bar. Excessive impurity elements such as arsenic and antimony in high-purity lead-free solder bars will significantly aggravate void formation, while an imbalanced tin-copper alloy ratio or fluctuations in silver content directly affect the surface tension and wetting behavior in the molten state, thereby altering the gas escape paths inside the solder joint.
Published: 2025-01-19During the rework soldering and BGA chip ball mounting process, an excessive void rate is the main cause of cold solder joints, increased thermal resistance, and early failures. Using low-void solder paste can significantly improve the metallurgical bonding quality of solder joints, and especially maintain structural integrity after multiple thermal cycles. In actual tests, the Jiajinyuan JGY-850 series solder paste stably controls the void rate within 8%. Combined with precise stencil aperture design and nitrogen-protected reflow, it increases the first-pass yield of rework soldering to 98.3%.
Published: 2024-02-28
Excessive flux paste application is a high-frequency cause of component displacement in SMT production lines, and this issue is particularly prominent when soldering tiny components such as 0201 and 0402 packages. Based on 20 years of on-site production line measurement experience of JJY, this paper focuses on the coordinated adjustment of three key factors: squeegee pressure, stencil aperture design, and printing speed. It proposes an immediately executable parameter window calibration method to directly target the process balance point between flux paste and component soldering stability.
Published: 2024-02-11X-Ray inspection is the only non-destructive method in SMT production lines that can penetrate packages to directly observe the internal structure of hidden solder joints such as BGA and QFN. It is mainly used to detect invisible defects such as solder joint voids, cold solder joints, and solder ball offset. Especially in the mass production of automotive-grade and industrial-grade high-reliability products, with 0.5μm detail resolution and real-time dynamic imaging capability, Jia Jinyuan X-Ray inspection equipment stably maintains the recognition rate of defective solder joints with a void rate exceeding 25% at over 99.7%.
Published: 2023-11-17Debugging the BGA soldering reflow curve requires precise matching of the solder paste activity window and solder ball melting characteristics. By optimizing the preheating slope, extending the soaking time, and controlling the peak temperature plateau width, the void rate can be significantly reduced. Test data from JJY shows that the void area ratio was reduced from 18.7% to below 6.2%.
Published: 2023-10-22Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.