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PCB pad treatment is a key pre-process for ensuring first-pass SMT soldering yield. Activation with Jia Jinyuan flux can effectively dissolve copper surface oxides, inhibit re-oxidation, and improve the wetting and spreading ability of solder paste. It demonstrates stable and reliable performance, especially in removing oxide layers on the pad surfaces of OSP boards and long-term stored PCBs.
Published: 2023-02-14Circuit board soldering faces multiple challenges of high reliability, fine pitch, and heat-sensitive components in the medical, communication, and new energy sectors. Based on practical production line experience, this paper focuses on key processes such as solder paste selection, stencil aperture design, reflow profile optimization, and BGA rework, emphasizing solder joint wettability, void rate control, and cold solder joint identification methods. All parameters are derived from measured data from Jia Jinyuan production lines, without theoretical deduction.
Published: 2023-01-22For soldering gold-plated boards, it is necessary to balance the thickness of the pad gold layer with the activity matching of the flux to avoid black pad, cold solder joints, and excessive IMC growth. Jia Jinyuan's gold-plated board soldering solution has achieved a soldering defect rate below 0.3% in aerospace modules and medical equipment, with the key lying in the collaborative implementation of solder paste selection, reflow profile gradient control, and an oxygen content ≤100ppm under a nitrogen atmosphere.
Published: 2022-11-25To address the issues of large fluctuations in solder paste deposition volume and frequent cold solder joints and solder bridges during high-density PCB solder paste printing, this paper proposes a solder paste volume control method based on measured production line data, with stencil aperture optimization, dynamic calibration of squeegee pressure, and temperature control of solder paste viscosity as its core components. It focuses on solving the challenge of solder paste deposition consistency for 0.4mm pitch QFN and 0201 components, significantly reducing the proportion of abnormal batches where the SPI first-pass yield is below 92%.
Published: 2022-08-17
If solder paste is improperly selected or incompletely cleaned during PCB soldering, residual halide ions and moisture will act together to trigger electrochemical migration, leading to corrosion of copper circuits on the PCB, reduced insulation resistance, and severely compromised long-term reliability, with the failure risk rising significantly especially in high-temperature and high-humidity environments.
Published: 2022-07-23PCB pad treatment is a key step in SMT production lines to ensure first-pass yield and line yield. For common issues such as pad oxidation, fingerprint contamination, and flux residue, targeted pre-treatment must be completed before solder paste printing; otherwise, defects such as cold solder joints, tombstoning, and solder bridging are highly likely to occur. Production line verification by Jiajinyuan shows that standardized PCB pad treatment can reduce the soldering defect rate of OSP boards from 3200 ppm to below 450 ppm.
Published: 2022-05-11ENIG gold-plated PCB boards in SMT production lines often suffer from cold solder joints and poor wettability due to nickel layer oxidation, abnormal gold layer thickness, or mismatched solder paste activity. Solder paste compatibility must take into account both the intermetallic compound growth window of ENIG solder paste and the PCB surface condition, with key control over the flux acid value, active temperature range, and metal powder sphericity in the solder paste to avoid excessive metallographic dissolution or insufficient IMC formation.
Published: 2022-03-14To address the issue of warpage that easily occurs in thin PCB boards during solder paste soldering, this paper starts from the rheological properties, metal content, thixotropic index of solder paste and the volatilization behavior of flux, proposes a selection and process coordination scheme adapted to thin board solder paste, and emphasizes the practical effects of low-stress solder paste, medium-low temperature reflow window and fine-tuning of printing parameters on suppressing warpage.
Published: 2021-09-06When manually soldering and repairing old PCBs, oxidized solder pads cause poor tinning and frequent cold solder joints. High-activity solder wire significantly improves the first-pass soldering success rate through stronger oxide film penetration and lower wetting temperature, and is especially suitable for manual soldering rework scenarios of communication boards and industrial control motherboards in service for over 8 years.
Published: 2021-06-22In multilayer PCB stack soldering, solder paste selection directly affects solder joint reliability and yield. It is necessary to comprehensively consider the melting point gradient, thixotropy matching, and flux residue characteristics of the stacked solder pastes. Especially when 0.3mm pitch BGA and fine-pitch QFN coexist, a dual-temperature-zone compatible solder paste must be selected, with the reflow peak temperature of the main solder paste at least 25°C higher than that of the underlying stacked solder paste, to avoid cold solder joints or solder balls caused by secondary reflow.
Published: 2021-04-30Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.