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Here you can find knowledge about PCB Wave Soldering Solder Bar, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
PCBA soldering materials cover a full range of auxiliary materials including solder paste, solder wire, flux, cleaning agent and nitrogen. Their selection and control directly determine the SMT placement first-pass yield and long-term reliability. The Jiajinyuan series performs stably under stringent parameters such as reflow soldering peak temperature of 235℃±5℃, solder paste viscosity of 700±100Pa·s, and flux solid content of 18.5%.
Published: 2021-04-07The selection and control of solder materials in electronics manufacturing directly determine the first-pass yield of PCBA. The metal content, viscosity, and slump resistance of solder paste must match the stencil apertures, reflow profile, and component density of the production line. Jia Jinyuan solder paste performs excellently in 0.3mm pitch QFN printing, while solder wire and solder bar require focused monitoring of rosin residue and wetting angle consistency.
Published: 2020-08-29The reflow oven's temperature zone configuration must match the PCB thickness and component heat capacity. Thin boards require shortened preheating time to prevent warpage, while thick boards need extended soaking zones to ensure uniform heating of inner layers. Large heat capacity BGA or metal-cased components require stable peak temperature and sufficient reflow time. The Jiajinyuan reflow oven achieves precise adaptation through adjustable conveyor speed and independent temperature control for each zone.
Published: 2020-05-25This paper focuses on the practical application of sensor solders in the SMT process of electronic sensor PCBs, covering the solder selection logic for common sensors such as thermal sensors, pressure sensors, and acceleration sensors, key points for reflow profile adaptation, and production line-level troubleshooting paths for cold solder joints and missed solder joints. It emphasizes the differentiated performance of two sensor solders, Jiajinyuan SN100C and SN63Pb37, in terms of wettability, residue activity, and thermal shock resistance.
Published: 2020-05-08Solder auxiliary materials are indispensable supporting consumables in the PCBA soldering process, among which flux and PCB cleaning solvent directly affect soldering wettability, residue control and subsequent reliability. The Jiajinyuan series flux is compatible with 0201 to QFN0.4mm pads in SMT reflow soldering and wave soldering scenarios. Its rosin-based active ingredients take effect at 150℃ and complete activation at 235℃. When used with Jiajinyuan halogen-free PCB cleaning solvent, the ROSE method ion contamination value can be achieved <0.78μg/cm2.
Published: 2019-12-02Through on-site testing of Jiajinyuan domestic solder on the SMT production line under combinations of different temperature zone profiles, stencil apertures, and squeegee pressure settings, the soldering performance on circuit boards was evaluated. It was found that the difference in wettability and void rate between this domestic solder and imported materials is less than 8%. After optimizing solder paste storage temperature control and fine-tuning the nitrogen purity of the reflow oven, the first-pass yield of PCBA increased from 92.3% to 96.7%, significantly reducing circuit board soldering defects such as cold solder joints, tombstoning, and bridging.
Published: 2019-08-26PCB pad treatment is a critical step in the SMT process to prevent oxidation-related failures. Strongly coupled control must be established among OSP film integrity, nitrogen storage duration, temperature and humidity thresholds, and turnaround timeliness. Production line tests by Jiajinyuan show that ENIG pads exposed for over 48 hours already exhibit significant poor wetting before reflow, while boards that undergo standardized PCB pad treatment and are stored in nitrogen cabinets with levels below 400 ppm maintain a stable first-pass soldering yield of over 99.7%.
Published: 2019-07-04Thermal cycling testing is a key method for PCBA reliability testing. Through harsh conditions of -40℃ to +125℃, temperature rise and fall completed within 5 minutes, and a 15-minute dwell per cycle, it simulates temperature stress changes of products in real environments, focuses on exposing microcracks in solder joints and fatigue failure of the IMC layer, and directly reflects the impact of SMT placement processes and reflow profiles on long-term service life.
Published: 2018-12-26
The solder paste can be directly applied to PCB pads, but this is limited to special scenarios such as rework, small-batch manual soldering, or BGA ball mounting. Direct application is strictly prohibited on conventional SMT placement production lines, otherwise it will cause problems such as solder paste printing misalignment, increased void rate after reflow, and corrosion of pads by residues. A comprehensive judgment must be made based on the specific process window, activity level of the solder paste, and surface treatment method of the PCB pads.
Published: 2018-08-11The one-stop provision of PCBA soldering materials must closely align with the actual needs of the production line. As a core material, solder paste must match stencil apertures, reflow profiles, and component spacing. Jia Jinyuan solder paste shows no obvious slump during 24 consecutive hours of printing on 0.3mm pitch QFN. When paired with flux of the corresponding activity level, low-oxygen solder wire, and high-purity solder bar, it ensures consistent yield in SMT placement and manual soldering rework.
Published: 2018-05-23Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.