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Here you can find knowledge about PCB Wave Soldering Solder Bar, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
During PCB pad processing, the soldering performance of ENIG, Immersion Silver and OSP processes differs significantly. The ENIG layer is oxidation-resistant but has poor wettability, requiring high-activity solder paste. Immersion Silver is prone to sulfidation discoloration and sensitive to reflow peak temperature. Uneven OSP film thickness can cause local non-wetting. The three processes must be managed differentially in stencil aperture design, reflow profile setting, and incoming material storage conditions.
Published: 2018-04-13Cold soldering is one of the most stubborn soldering defects in SMT production of large thick copper boards, occurring frequently especially on PCBs with copper thickness ≥2oz and dimensions ≥400mm×300mm. The root cause is that the large heat capacity of the copper substrate and delayed temperature rise lead to insufficient solder paste reflow. In production line tests, Jiajinyuan cold soldering repair paste can reduce the cold soldering defect rate from 1.8% to below 0.3%.
Published: 2018-02-07Selective wave soldering significantly reduces changeover time and fixture debugging frequency by precisely positioning soldering areas and skipping already surface-mounted components. In multi-variety, small-batch PCBA production, it compresses the preparation cycle per batch to within 15 minutes, greatly improving overall equipment effectiveness, and serves as the core process support for Jiajinyuan models to achieve high output in small and medium batch order scenarios.
Published: 2017-12-09High-voltage and insulation testing in PCBA reliability testing is a critical process on the production line for determining whether a circuit board has potential risks of current leakage, creeping discharge, or dielectric breakdown. By applying a specified voltage and monitoring changes in leakage current, it can effectively identify real production line issues such as PCB lamination defects, solder bridging, flux residue, and insufficient cleanliness, providing a hard safety threshold for the delivery to JJY customers.
Published: 2017-11-27In PCBA reliability testing, vibration testing must accurately reproduce the wide-band, high-acceleration, multi-axis coupled operating conditions in energy storage vehicle environments. Production line tests conducted by JJY show that performing only sinusoidal frequency sweep per the IEC 60068-2-6 standard will miss microcracks in solder joints and BGA cold solder joints. It is necessary to superimpose random vibration spectra and three-axis synchronous excitation to effectively expose structural weak points in PCBA reliability testing.
Published: 2017-09-26The solder for industrial control motherboards is specifically designed for high-reliability soldering of industrial control motherboard PCBA. It features excellent wettability, low void rate, and strong thermal cycle resistance, meeting the demands of harsh scenarios such as wide temperature range, long service life, and vibration resistance. It is a core material for ensuring the long-term stability of solder joints on industrial control motherboards.
Published: 2017-06-01Jiajinyuan PCBA soldering materials are specifically designed for new energy battery management system BMS boards, photovoltaic inverter control boards, and industrial PLC main control boards. Its low-void-rate solder paste maintains a stable void area of less than 12% after reflow in 0.3mm fine-pitch QFN packages, which can be further reduced to 8.5% with a nitrogen atmosphere, meeting the stringent requirements of automotive-grade AEC-Q200 for solder joint reliability.
Published: 2016-12-27High-frequency PCB soldering is extremely sensitive to the halogen content and residue control of solder paste. Jiajinyuan halogen-free low-residue solder paste, by optimizing the rosin system and activator ratio, ensures wettability while reducing ionic contamination to below 0.25μg/cm2, significantly minimizing impedance fluctuations and phase shifts in high-frequency signal transmission.
Published: 2016-12-13Humidity control in the immersion silver board welding workshop is a key process measure to suppress silver layer migration. When the ambient relative humidity is higher than 60%RH for a long time, an electrolyte film is easily formed on the surface of the immersion silver board, which accelerates the electrochemical migration of silver ions between the pad and the edge of the solder mask. Actual measurements on the Jia Jinyuan production line show that stably controlling the humidity within the range of 40% to 55%RH can reduce the silver migration failure rate by 72%. Combined with nitrogen-protected reflow soldering and matching the activity level of the solder paste, it can significantly improve the long-term reliability of immersion silver board welding.
Published: 2016-11-22First Article Inspection is a full-item verification action performed on the first PCB after the SMT production line starts up and changes boards, covering key links such as solder paste printing, placement accuracy, reflow soldering effect, and AOI false alarm rate. It compares measured data with process parameters and BOM/GERBER consistency to avoid risks of batch material misplacement, offset, or cold soldering, ensuring an accurate and reliable starting point for process control.
Published: 2016-05-17Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.