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Here you can find knowledge about PCB Wave Soldering Solder Bar, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
For reworking oxidized PCB pads, two issues must be addressed simultaneously: the surface oxide layer and poor wetting. Jia Jinyuan high-activity flux can effectively reduce CuO and lower interfacial tension. Combined with light mechanical scraping and nitrogen-protected reflow, it raises the first-pass rework yield of oxidized pads to over 92%, significantly outperforming the 65% achieved by traditional rosin-based flux.
Published: 2012-09-29In circuit board soldering, solder paste, solder wire, and solder bar each have their own dedicated roles: solder paste is exclusively used for SMT placement reflow soldering, solder wire is suited for manual touch-up soldering and rework, and solder bar is limited to pre-tinning in wave soldering or tin coating on high-power heat sinks. Selecting the wrong solder material will lead to common high-frequency production line defects such as cold solder joints, bridging, and poor wetting.
Published: 2012-05-18The incompatibility of solder paste with PCBs featuring different surface finishes is a root cause o
Published: 2011-09-08Dip soldering is a core process for high-volume PCBA pin soldering. The composition, melting point, and oxidation control of wave soldering solder bars directly determine solder joint wettability and cold solder joint rate. Jia Jinyuan wave soldering solder bars can maintain a solder wave height deviation of ≤0.3 mm and a solder dross generation rate of less than 1.2% during 8 consecutive hours of production, significantly reducing fixture rework frequency.
Published: 2011-07-29Circuit board soldering covers core processes such as SMT placement, wave soldering, and manual soldering, each of which imposes stringent requirements on solder paste printing accuracy, temperature profile control, flux selection, and PCB board deformation tolerance. Production line tests by Jia Jinyuan show that for 0.3mm pitch QFN devices, a reflow soldering peak temperature deviation exceeding ±2℃ causes cold solder joints, while insufficient wave soldering fixture press-in depth below 0.15mm leads to through-hole solder joint climb height falling below the 0.75mm standard value.
Published: 2011-05-22To address the challenge of cleaning residual stains on solder paste boards, it is necessary to simultaneously optimize solder paste selection and process parameters. While no-clean solder paste reduces cleaning pressure, it is more sensitive to stencil apertures and reflow environments. In contrast, traditional solder paste paired with cleaning requires chemical compatibility between the cleaning agent and solder paste residues. The cleaning effectiveness of solder paste is directly influenced by its metal content, rosin system, and activator type.
Published: 2011-04-17Consumer electronics solders must balance low melting point, high wettability, and low corrosivity of residues. Especially in high-density PCBA soldering for mobile phone earphones and similar devices, Jia Jinyuan SN96.5AG3.0CU0.5 solder has been experimentally measured to have a wetting angle of <25° on 0.3mm pitch BGA and 0201 components, with the post-reflow ICT test defect rate stably controlled within 80ppm.
Published: 2011-01-18Silver-plated board soldering is a critical step in the SMT process where abnormalities such as pad blackening, poor wetting, and excessively thin IMC layers are prone to occur. Based on actual production line cases from Jia Jinyuan, this article focuses on the dependence of silver-plated board soldering on the quality of PCB silver surface treatment, and provides a detailed explanation of practical key points such as silver layer thickness control, OSP residue impact, reflow profile adaptation, and stencil aperture compensation.
Published: 2011-01-04During the soldering process of immersion silver boards, excessively high flux activity will accelerate the oxidative corrosion of the silver layer, leading to blackened solder joints, poor wetting, and subsequent false judgments in ICT testing. By controlling the acid value of the flux, optimizing the reflow peak temperature and nitrogen purity, and combining with the precise selection of Jiajinyuan JY-806A medium-activity rosin-based flux, silver surface discoloration can be effectively suppressed, and the first-pass soldering yield can be improved.
Published: 2010-10-21Cold soldering is one of the most hidden and stubborn soldering defects in SMT production lines. It is often induced by a combination of non-compliant reflow temperature profiles and excessive PCB heat capacity, resulting in insufficient melting of solder paste, poor wetting of solder joints, and insufficient thrust. In Jiajinyuan cold soldering cases, 83% stem from a reflow zone peak temperature below 217℃ and a heating ramp rate lower than 1.5℃/s.
Published: 2010-02-04Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.