Moisture-absorbed Solder Paste is prone to generating bubbles during the Reflow Soldering process, which will directly lead to a decrease in Solder Joint Strength.

Solder paste moisture absorption mainly occurs because the storage environment humidity exceeds the standard or the sealed package is damaged, both of which will cause the Flux components in the solder paste to react.

Once moisture absorption of the solder paste is found, use must be stopped immediately, otherwise it may lead to defective products in batches.

During operation, the production date and packaging status of the solder paste must be strictly checked to ensure that it is not expired and the seal is intact.

The solder paste needs to be fully stirred before use to ensure that the flux is evenly distributed and avoid local moisture absorption.

Improper setting of reflow soldering process parameters will also aggravate the problem of moisture-absorbed solder paste, and the temperature curve should be adjusted according to the actual materials.

Keeping the work area dry is an important measure to prevent solder paste moisture absorption. It is recommended to use dehumidification equipment and conduct regular inspections.

When purchasing, choose suppliers with good reputation to ensure stable solder paste quality and reduce the risk of moisture absorption.

The solder paste should be used up as soon as possible after opening, as prolonged exposure to air will increase the probability of moisture absorption.

Operators need to receive professional training to understand the correct usage and storage requirements of solder paste.