Solder Paste needs to maintain stable physical and chemical properties during production, and refrigeration can effectively inhibit the volatilization and oxidation reaction of the Flux in the solder paste, avoid viscosity changes or caking caused by excessive temperature, thereby ensuring the uniformity and operability during the printing process.

In actual production, it has been found that after unrefrigerated solder paste is stored in a high-temperature environment for 48 hours, its fluidity will decrease significantly, and problems such as missing printing or collapse are prone to occur during printing, which seriously affects the subsequent soldering effect of Reflow Soldering. The refrigerated solder paste needs to be fully warmed up to room temperature before use to avoid damage to the solder paste structure caused by excessive temperature difference.

Solder paste refrigeration is also closely related to the humidity of the storage environment. Excessive humidity will cause the solder paste to absorb moisture and expand, increasing the risk of splashing, and at the same time affecting the mechanical strength of the solder joints. Therefore, it is recommended to store the solder paste in a constant temperature and humidity refrigerator, with the temperature controlled at 5-25°C and the relative humidity not exceeding 60%.

In procurement and inventory management, solder paste refrigeration is also an important means to reduce losses. If the solder paste exceeds the shelf life or is not stored in accordance with the specifications, it will not only increase the production cost, but also may cause product failures due to poor soldering. Therefore, formulating strict Solder Paste Storage and use procedures is a core measure to improve SMT process efficiency and product quality.

Solder paste refrigeration also involves material batch management. Different batches of solder paste have different storage times under refrigerated conditions, and the use order needs to be reasonably arranged according to the technical parameters provided by the supplier to avoid resource waste caused by expiration or deterioration.

For solder paste used frequently, it should be used as soon as possible after refrigeration to avoid performance degradation caused by repeated unsealing. At the same time, it should be sealed in time after each use to prevent pollution caused by air contact. These detailed operations directly affect the overall performance of the solder paste and the reliability of soldering.

Solder paste refrigeration is not only a process requirement, but also a necessary means to ensure production continuity and product quality, and must be implemented in strict accordance with relevant specifications.