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Eutectic solder has a fixed single melting point in SMT production lines, enabling simultaneous melting and solidification, which significantly reduces thermal stress and void rate. Under the Sn96.5Ag3.0Cu0.5 system, the measured melting point of Jia Jinyuan eutectic solder is stable at 217.5℃±0.3℃, suitable for reflow soldering process control of high-density packages such as BGA and QFN.
Published: 2013-10-28Soldering thick-copper PCBs places extremely high demands on solder paste rheology, wetting force, and anti-slump performance. During selection, practical production-line issues caused by thick copper—such as rapid heat dissipation, high pad thermal mass, and high tendency of printing misalignment—must be comprehensively considered. Priority should be given to thick-copper solder pastes with high metal content, low thixotropic index, and specially formulated active flux, to ensure sufficient wetting and reliable solder joint formation under conventional reflow profile conditions.
Published: 2013-09-16The tombstoning phenomenon in SMT defects is mostly caused by uneven heating at both ends of chip components, commonly seen in resistors and capacitors in 0402 and 0603 packages. When the solder paste at one end melts and wets first while the other end remains solid, the imbalance of surface tension pulls the component vertically upward. Statistics from JJY's production line show that this defect accounts for 37% of post-placement rework volume, with root causes concentrated in deviations in stencil aperture design, abnormal temperature zone distribution in reflow ovens, and asymmetric PCB layout.
Published: 2013-08-26To meet the actual production line requirements for solder materials used in industrial control motherboards, this summary focuses on the compatibility issues of solder paste in SMT printing, reflow soldering and wave soldering processes, and elaborates on the synergistic performance of Jiajinyuan solder paste and matching solder bars in high-reliability soldering, covering key process parameters such as viscosity adaptation, metal content control, and residue corrosion inhibition.
Published: 2013-06-25
Although adding antioxidants to solder bars can significantly delay oxidation reactions and reduce the amount of dross generated during high-temperature molten soldering, it cannot completely eliminate dross formation due to multiple production line variables such as wave soldering temperature fluctuations, flux residue decomposition, molten solder agitation intensity, and alloy composition segregation. There are clear process boundaries for the effectiveness of solder oxidation resistance.
Published: 2013-06-07
The tin slag rate in solder wire production directly reflects the stability of the smelting process and the level of raw material purity control. An excessively high tin slag rate often indicates intensified oxidation of molten tin, accelerated impurity enrichment, or uncontrolled temperature fluctuations, which can easily lead to batch defects in finished solder wire such as slag inclusions, uneven wire drawing, and reduced wettability.
Published: 2013-03-19To address the persistent production line issues of small component placement offset and solder paste printing mismatch, this paper proposes a practical solution centered on solder paste forming accuracy, with coordinated adjustment of stencil apertures, squeegee parameters, and placement coordinates. It emphasizes the decisive influence of the actual coverage morphology of solder paste on pads on the solder paste positioning tolerance during placement.
Published: 2013-02-18
Stainless steel welding imposes special requirements on the activity, melting point, and flux composition of solder wire. Ordinary solder wire cannot achieve reliable connections at all due to insufficient rosin activity, poor wettability, and its inability to effectively break down the dense oxide film on stainless steel surfaces. Dedicated stainless steel solder wires containing halogen activators or organic acid composite systems must be selected, and used in coordination with mechanical grinding and flux paste.
Published: 2013-01-22
The standard control specification for solder paste printing thickness is typically 120±20μm. This value must be dynamically adjusted based on stencil aperture dimensions, squeegee pressure and speed, and the rheological properties of the solder paste. In actual production lines, over 80% of cold solder joint and solder bridge defects can be traced back to out-of-tolerance printing thickness deviations.
Published: 2012-12-05Ball mounting process yield control should focus on solder paste printing consistency, stencil tension stability, and reflow profile matching. By monitoring squeegee pressure fluctuations in real time, optimizing the vacuum suction parameters of the ball mounting machine, and calibrating visual positioning offsets, the incidence of cold solder joints and solder ball misalignment can be significantly reduced. On Jiajinyuan's production line, the measured defect rate per batch of ball mounting was reduced from 0.87% to 0.23%. The key lies in coupling all stages of the ball mounting process into a closed-loop feedback system.
Published: 2012-11-16Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.