SMT Solder Paste Manufacturers.
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Jia Jinyuan provides free solder sample testing and sample mailing services. All solder sample tests are conducted synchronously on real SMT placement lines and wave soldering production lines, covering mainstream packages such as 0201 to QFN48. The measured yield data can be traced back to the furnace temperature curve and AOI original image of each batch. The solder sample test results are directly related to the customer's existing stencil opening, reflow soldering temperature setting and flux compatibility.
Published: 2011-06-14
The melting point of lead-free solder wire is usually between 217°C and 227°C. During actual soldering, the soldering iron temperature should be set between 320°C and 360°C to compensate for heat loss and ensure wettability. Different wire diameters, flux contents, and PCB heat capacities significantly affect the optimal temperature setting. In production lines, real-time fine adjustments are often made through spike tests and solder joint gloss inspection.
Published: 2011-05-07FPC soldering has extremely stringent requirements for halogen residue, wettability, and residue insulation of solder paste. Jiajinyuan halogen-free solder paste strictly controls bromine and chlorine content below 900ppm, leaving no corrosive ion residue after reflow, while maintaining excellent slump resistance and 0.3mm fine-pitch printing stability. It has been successfully applied to high-end product lines exported to the EU, Japan, and South Korea, such as automotive camera modules and foldable screen hinge FPCs.
Published: 2011-04-25RoHS solder SGS testing certification is a mandatory threshold for export-oriented EU electronic assembly production lines. Jiajinyuan RoHS solder has passed SGS's full set of heavy metal and organic substance testing, with all six items—lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers—meeting the standards. Customs clearance documents include the original SGS report, Declaration of Conformity, Material Safety Data Sheet, and batch factory inspection records, and the complete set of documents can be directly used for customs declaration and customer factory audits.
Published: 2011-04-11Loss of temperature and humidity control in the SMT printing workshop will cause fluctuations in solder paste viscosity, leading to defects such as insufficient solder, solder bridging, and misalignment. Jiajinyuan solder paste has the most stable viscosity under an environment of 22℃±2℃ and 45%RH±5%RH. When the temperature difference exceeds 3℃ or the humidity deviation exceeds 8%RH, the printing defect rate will rise. Process control must be achieved through closed-loop monitoring and zoned humidity control.
Published: 2011-03-20Domestic solder covers wire diameters from 0.3mm to 3.0mm, all temperature ranges (183℃~227℃) for both leaded and lead-free variants, and three flux systems: rosin, no-clean, and water-washable. It is compatible with multiple scenarios including high-speed SMT printing, wave soldering, dip soldering, and manual touch-up soldering. The Jiajinyuan series has a measured wetting angle ≤35°, bridging rate below 0.08%, and residual ion content <0.5μg/cm2. No adjustment to stencil apertures or reflow temperature profile is required when switching materials on the production line.
Published: 2011-03-06High-activity solder paste is specifically designed for sensor soldering applications, delivering excellent wetting performance on heavily oxidized PCB pads. It effectively resolves cold solder joints and tombstoning defects caused by pad oxidation after high-temperature storage, multiple reflow cycles, or long-term exposure with conventional solder pastes. It is particularly well-suited for the fine pads and low thermal mass requirements of precision sensors such as MEMS, pressure, temperature and humidity sensors.
Published: 2010-11-12The pre-drying process of solder paste printing directly affects the viscosity stability of the solder paste and the formation quality of solder joints. Excessive drying will cause the flux to volatilize in advance and increase the risk of solder paste collapse, while insufficient drying can easily lead to stencil clogging and printing deviation. Based on 20 years of measured data from the Jiajinyuan production line, this paper analyzes the actual impact of different temperature zone settings on the rheological properties of printed solder paste and the void rate after reflow soldering.
Published: 2010-11-11
High impurity content in solder bars directly causes typical wave soldering defects such as solder spikes, bridging, and cold soldering. Elements such as copper, iron, and arsenic in solder impurities not only reduce wettability, but also accelerate oxidation of the solder pot and clog the nozzles, seriously affecting the line throughput yield and the service life of the solder bars.
Published: 2010-08-24For the common insufficient solder defects in SMT production lines, it is necessary to wipe the bottom of the stencil with a lint-free cloth dipped in IPA after every 10 to 15 PCBs are printed, and thoroughly clean the stencil once a week with an ultrasonic cleaning machine. Meanwhile, choose the JIAJINYUAN JL-8802 series solder paste, which has a viscosity change rate of less than 8%, a slump rate of less than 12%, and a printing release stability of 99.3% at room temperature of 25℃, and can significantly reduce the incidence of insufficient solder.
Published: 2010-08-19Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.