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Solder paste stencil printing defects are a high-frequency failure in SMT production lines. Essentially, they occur when solder paste fails to transfer completely onto PCB pads. The root causes are often intertwined with stencil aperture accuracy, tension degradation, and the rheological properties of the solder paste. It is necessary to simultaneously inspect stencil wear status, squeegee pressure parameters, and changes in solder paste viscosity. Neglecting any of these aspects will lead to false yield fluctuations.
Published: 2010-05-16
Eco-friendly solder wire is not equivalent to RoHS compliance. It is necessary to confirm whether the content of six hazardous substances, including lead, mercury, and cadmium, is below the limit through a third-party test report. A supplier's verbal commitment or "lead-free" label alone cannot replace actual test data. Production lines often overlook batch differences, resulting in typical RoHS non-compliance symptoms such as dull solder joints and poor wetting after the entire batch of PCBs goes through the reflow oven.
Published: 2010-04-07The wiping frequency of solder paste stencils directly affects the uniformity and profile clarity of printed solder paste. Excessive wiping accelerates stencil tension decay and causes insufficient solder paste deposition, while insufficient wiping easily leads to solder paste drying, aperture clogging, and induces typical defects such as solder bridging and insufficient solder. Therefore, to scientifically formulate solder paste control strategies, wiping frequency must be included as a key process parameter for dynamic calibration.
Published: 2010-03-19In the tin dipping process, flux selection directly affects the incidence of pinholes on the tin surface and copper exposure defects. JJY JY-806A has been verified on actual production lines to reduce the pinhole rate from 3.2% to 0.4%. Its low solid content, highly active rosin derivative system, and the characteristic of a copper surface wetting angle of less than 28° work together to significantly improve the uniformity of molten tin spreading and gas escape paths.
Published: 2010-03-14X-Ray inspection can penetrate BGA packages to directly observe solder ball morphology, void distribution, and bridging defects, making it an irreplaceable method for verifying the internal quality of reballing soldering after rework. Especially after reballing operations are completed on JJY rework stations, X-Ray inspection must be performed to confirm whether solder ball coplanarity, offset, and void rate comply with IPC-A-610 Class 2 standards.
Published: 2010-02-27Cold soldering is one of the most hidden and stubborn soldering defects in SMT production lines. It is often induced by a combination of non-compliant reflow temperature profiles and excessive PCB heat capacity, resulting in insufficient melting of solder paste, poor wetting of solder joints, and insufficient thrust. In Jiajinyuan cold soldering cases, 83% stem from a reflow zone peak temperature below 217℃ and a heating ramp rate lower than 1.5℃/s.
Published: 2010-02-04
Severe oxidation of solder bars directly leads to solder joint spikes, cold solder joints, and increased solder dross. Intervention must be carried out simultaneously from four aspects: storage environment, solder melting temperature, flux ratio, and squeegee maintenance. Among them, controlling the solder pot temperature at 250±5℃, using special flux containing antioxidant components, and keeping solder bars dry and sealed during storage are the three most effective practical measures to reduce solder oxidation.
Published: 2010-01-30Based on measured production line data, this paper compares the differences among SAC305 solder paste, SAC0307 solder paste, and low-temperature tin-bismuth solder paste in terms of printability, reflow performance, and solder joint reliability. It highlights the wetting advantages of SAC solder paste in the high-temperature zone and the irreplaceability of tin-bismuth solder paste in soldering temperature-sensitive components, providing reproducible criteria for process selection.
Published: 2010-01-22
The tensile strength and elongation of solder wire directly determine the stability and workability of soldering performance. Insufficient tensile strength easily causes wire breakage and jamming during automatic wire feeding, while inadequate elongation leads to difficulties in dragging solder during manual soldering and solder joint spikes. The two jointly affect SMT pre-tinning, wave soldering bridging control, and rework yield.
Published: 2009-10-09
When purchasing solder bars, solder purity directly affects soldering reliability and production line yield. The quality of solder bars can be quickly preliminarily assessed by observing the fluidity in the molten state, the gloss of the fracture surface after cooling, the scraping feel, and the differences in flux reaction. Combined with on-site scanning using an XRF detector, the content of impurities such as lead, copper, and iron can be accurately identified, avoiding cold solder joints, poor wetting, or PCB corrosion caused by insufficient purity.
Published: 2009-08-15Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.