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In SMT printing, the matching of squeegee pressure and speed directly affects solder paste transfer rate. Excessive pressure easily causes solder spikes and stencil deformation, while insufficient pressure leads to insufficient solder and edge collapse. Combined with actual production line data of Jiajinyuan squeegees, controlling the pressure at 4.5±0.3kg and setting the speed to 45±3mm/s can significantly reduce the defect rate.
Published: 2012-08-17Solder paste printing offset defects directly affect the SMT first-pass yield. The root causes often stem from uneven stencil tension, worn PCB positioning pins, and calibration deviations in the printing machine's vision system. Selecting solder paste with high thixotropy and low slump rate can significantly improve the edge definition of printed solder paste and solder paste positioning accuracy. Combined with dynamic matching of squeegee pressure and speed, the offset can be quickly reduced without replacing equipment.
Published: 2012-08-07
When soldering nickel sheets with solder wire, low-temperature active solder wire containing 0.3%~3% silver must be selected. Ordinary lead-free solder wire is prone to cold solder joints due to poor wettability and excessively thick interfacial intermetallic compound layers. In actual production lines, SN63PB37 or SAC305 is commonly used with rosin-core flux to achieve reliable connections.
Published: 2012-07-31Poor wetting of oxidized old pads during rework soldering is a high-frequency production line failure. Jia Jinyuan JY-808 high-activity flux can effectively reduce the CuO layer and lower surface tension. Combined with precise temperature-controlled soldering tip operation in a 350°C nitrogen environment, it increases the spread rate of solder paste on oxidized copper pads from less than 40% to over 92%, significantly shortening the rework cycle and reducing missed detection of cold solder joints.
Published: 2012-07-22The reflow parameters of solder paste directly affect solder joint wettability, void rate and component reliability. An excessively fast heating rate can easily cause solder beads and PCB warpage, while insufficient peak temperature leads to cold soldering, and excessively high peak temperature will damage heat-sensitive devices. In actual production lines, the solder paste reflow profile needs to be dynamically adjusted according to the solder paste model, PCB thickness and component layout.
Published: 2012-07-19RoHS solder is directly supplied by domestic manufacturers and supports sample verification. Jiajinyuan RoHS solder has passed all SGS tests, with lead content <100ppm, cadmium <50ppm, hexavalent chromium <1000ppm, and melting point fluctuation between batches ≤±1.5℃. It is suitable for mainstream packages such as 0201 to QFN48. When used with rosin-based flux in a nitrogen environment, it achieves a wetting angle <35°, and the thickness of the solder joint IMC layer is stably controlled within the range of 1.2～1.8μm.
Published: 2012-05-04Automotive electronic solder is prone to microcracks and interfacial delamination during high-low temperature cycling. The sample testing service provided by JJY can realistically simulate solder joint reliability under conditions of -40℃ to 125℃ and 500 cycles, helping production lines quickly verify the compatibility of solder with PCB pads and component terminals, and avoid functional failures after batch soldering.
Published: 2012-03-11ASEAN foreign trade solder has passed the full-item testing of the RoHS Directive and multiple physical, chemical and toxicity tests conducted by SGS. The contents of restricted substances such as lead, cadmium, mercury, hexavalent chromium, polybrominated biphenyls, and polybrominated diphenyl ethers are all lower than the mandatory thresholds of the EU and mainstream ASEAN countries. With complete batch factory inspection reports and certificates of origin, it can be directly used for the access filing of SMT production lines in electronic foundries in Vietnam, Thailand, Malaysia and other countries.
Published: 2011-11-12The incompatibility of solder paste with PCBs featuring different surface finishes is a root cause o
Published: 2011-09-08In the ball mounting process, the size, shape and taper of stencil apertures directly affect the consistency of solder ball formation. Actual measurements by Jia Jinyuan show that 0.35mm circular apertures with 8° single-sided taper can keep the diameter fluctuation of over 95% of solder balls within ±0.015mm. Combined with the parameter set of squeegee pressure 0.3MPa and release speed 25mm/s, it significantly reduces defects such as missing balls and bridging balls.
Published: 2011-09-05Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.