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The Jiajinyuan R&D team has been continuously optimizing the formulation system in response to solder performance bottlenecks, and has developed 12 major halogen-free and lead-free solder series covering the full temperature range of high, medium, low and ultra-low temperatures. Its domestic high-end solders have achieved breakthroughs in key indicators such as QFN/DFN solder wetting rate, low void rate for automotive lamps, and no solder balls in laser welding.
Published: 2015-01-08
The design of solder paste stencil aperture openings directly affects the release performance of stencil printing and the forming quality of solder paste. Undersized apertures lead to insufficient solder paste volume and edge tearing, while oversized apertures easily cause bridging and slumping. Moreover, the aperture shape, wall roughness, and taper design alter the contact area and separation stress between the solder paste and the stencil. These factors are often overlooked in actual production lines, yet they directly determine the first-pass yield and SPI yield.
Published: 2014-12-18Ionic contamination of solder paste, decreased insulation resistance, and electrochemical migration are hidden yield killers in SMT production lines. Based on Jiajinyuan's 20 years of practical experience in third-party solder paste testing, this paper analyzes the migration pathways of halogen residues, organic acid activators, and metal ions in flux solder paste under temperature and humidity environments, and identifies failure precursor features that conventional solder paste testing cannot cover.
Published: 2014-11-20OSP board soldering is a critical process in SMT production lines that is highly prone to cold solder joints, poor wetting, and pad oxidation failures. It is necessary to optimize stencil aperture design, solder paste selection, reflow profile, and first-article verification process in response to the thermal sensitivity, thin-layer characteristics, and weak adhesion to the copper substrate of the OSP anti-oxidation protective film. Otherwise, even if the placement accuracy meets the standards, batch issues such as dull solder joints, insufficient solder climb height, or abnormal ICT test impedance will occur after reflow.
Published: 2014-11-10The pressure adjustment of the squeegee for solder paste printing directly affects the solder paste forming quality. Excessive pressure will cause solder paste collapse, solder spikes or leakage under the stencil, while insufficient pressure will lead to insufficient solder volume, jagged edges or local missing printing. Combined with the rheological properties of printing solder paste and solder paste parameters such as viscosity, metal content and thixotropic index, on-site fine-tuning within the range of 50～120N is required, while simultaneously observing the stencil rebound status, squeegee trailing marks and pad filling completeness.
Published: 2014-10-12Excess solder is the most easily overlooked yet highly consequential defect in the SMT printing process. Excessive solder paste transfer is directly caused by oversized stencil apertures and improper setting of squeegee angle, pressure, and speed parameters, which in turn triggers cascading issues such as bridging between pads, tombstoning, and post-reflow solder balls. On-site data from JJY shows that when the aperture area ratio exceeds 1.05 and the squeegee pressure is >6.5kg, the incidence of excess solder increases by 3.2 times.
Published: 2014-07-15Reflow ovens are core equipment in SMT production lines that enable precise solder melting and reliable connections. By precisely controlling the temperature ramp-up rate, soaking time, and peak temperature through segmented temperature control, they directly affect the occurrence rate of defects such as cold solder joints, tombstoning, and cold soldering. Jiajinyuan reflow ovens can stably support 0201 components and QFN5x5 double-sided mixed mounting processes in actual mass production.
Published: 2014-04-28Addressing the frequent solder bridging, shorting, and solder ball defects of solder paste that occur during SMT placement of devices with 0.3~0.4mm fine-pitch pins, this paper proposes a rapid, reproducible optimization pathway for solder paste printing parameters based on real production line cases. It covers key control points including stencil aperture design, squeegee pressure and speed matching, and solder paste pre-warming and stirring specifications, and emphasizes the decisive influence of solder paste printing stability on the subsequent formation of solder balls during reflow soldering.
Published: 2014-04-07The solution to solder paste printing slump and poor release defects focuses on real production line pain points. From stencil aperture design, solder paste rheological properties, squeegee parameter matching to environmental temperature and humidity control, it systematically sorts out six key factors leading to solder paste slump and poor release, and provides an immediately executable parameter adjustment list and verification methods, helping engineers locate the main cause of solder paste release defects within 30 minutes.
Published: 2014-01-15Solder paste printing skip is a high-frequency defect on SMT production lines, directly related to the rheological properties of solder paste, stencil aperture design, and matching of squeegee parameters. Based on Jiajinyuan's 20 years of production line measurement experience, this paper focuses on solder paste, printing process stability, and root causes of solder paste skip, and proposes an immediately executable six-step troubleshooting method, covering real failure scenarios such as viscosity fluctuation of solder paste batches, insufficient stencil support rigidity, and sudden changes in squeegee pressure.
Published: 2013-12-03Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.