Over the past three years, Jia Jinyuan's R&D team has focused on regulating the microstructure of solder and balancing the Flux activity mechanism. They have systematically reconstructed the interfacial compatibility model between the rosin matrix and metal powder, and simultaneously completed gradient adaptation verification for more than ten alloy systems, including 0307, 305, and In52Sn48. This has enabled domestic high-end solder to form a differentiated technical path in terms of thermal stability, wetting and spreading properties, and residue insulation. Currently, dozens of customer production lines have completed multiple rounds of process window testing and entered the mass supply stage.

To address the industry pain point of insufficient solder climbing on QFN/DFN devices in high-density packaging scenarios, the 8MQP/5RQ series features a synergistic design of T4-grade ultra-fine spherical alloy powder and ROL1-type low-halogen rosin carrier. The measured solder climbing rate reaches 98.7%, a 22 percentage point improvement over conventional lead-free Solder Pastes. Meanwhile, the 8MNTTP/5RNTT series further reduces the total halogen content to 100~200ppm, demonstrating excellent ionic residue suppression in the soldering of fingerprint lock modules and folding screen hinge PCBs, meeting the IPC-J-STD-004B Class L0 cleanliness requirements.

To meet the stringent demands of automotive electronics for long-term thermal cycle reliability of solder joints, the 8M9P/5RR zero-halogen high-temperature solder paste uses a combination of ROL0-grade purified rosin and SC07NG nickel-germanium micro-alloyed powder. In the soldering of automotive headlight LED brackets, the void rate is stably controlled within 3.2%. Coupled with a 240~260℃ soldering window and T5-grade powder particle size distribution, it significantly outperforms imported similar products in terms of shear strength degradation after 1000 hours of high-temperature aging at 150℃.

In the emerging field of laser welding applications, the 5RLJ and 5RLJB series rely on T6/T7 ultra-fine powder and low-volatility flux compounding technology. They not only achieve rheological stability control during the dispensing process of pneumatic valves and jet valves but also maintain a solder ball defect rate below 0.03‰ under 8 hours of continuous operation with screw valves. Currently, they have been applied in the TO packaging of optical modules and the micro battery soldering process of TWS earphones.

Progress has also been made in water-washable solder systems. The 8MW5/5RW5 series balances a wetting angle of less than 25° and a surface resistivity of greater than 1×10¹¹ Ω·cm after deionized water cleaning in the soldering of stainless steel and aluminum substrates. The 8MW1AP/5RW1A optimizes the compatibility of Bi-based low-temperature alloys with water-soluble carriers for nickel-plated aluminum fin scenarios in radiators. After soldering, it reaches the IPC-A-610G Class 2 cleanliness standard by rinsing with pure water at 60℃, reducing the overall cost by 17% compared to traditional no-clean solutions.

Currently, Jia Jinyuan's solder product matrix covers four major alloy families: SnAgCu, SnBiAg, SnIn, and special SnCuNiGe, with corresponding melting point ranges spanning from 65℃ to 255℃. Among them, the particle size control accuracy for seven powder grades from T3 to T7 reaches ±0.5μm. All series have passed SGS halogen-free certification and REACH regulation compliance verification. The adoption progress of domestic high-end solder in cutting-edge scenarios such as communication base station PA modules, automotive millimeter-wave radar PCBs, and AR glasses Micro-LED transfer is being updated on a quarterly basis.