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Domestic halogen-free solder paste LFP?5RQ?0307 achieves nearly 100% solder wetting in QFN packages, with its high activity and alloy powder characteristics being the key factors. Optimizing printing parameters and reflow profile can further improve soldering quality.
To address the challenge of void rate control in automotive lamp welding, the LFP?5RR?305 halogen-free REACH solder paste is an ideal choice thanks to its extremely low void rate and high reliability. It is suitable for precision welding in high-heat scenarios, effectively improving product yield and stability.
LFP?5RNTT?305 solder paste is specially designed for high-precision electronic devices such as mobile phones, Bluetooth, and fingerprint locks. Its halogen-free and lead-free properties and excellent solder climbing performance stand out in SMT processes, making it suitable for precise soldering of complex circuit boards, while meeting the dual environmental and reliability requirements of the ROL0 standard.
LFP?5RTS?0307 translucent residual solder paste demonstrates stable performance in medium solder fillet formation mass production for QFN/DFN packages, offers good process adaptability, and its no-clean feature significantly reduces post-processing costs, making it suitable for high-density electronic manufacturing scenarios.
For large-pitch conventional SMT production scenarios for LEDs, LFP-8MA-SC07 lead-free solder paste, with its high activity, low residue, and good solder climbing performance, is an ideal soldering material in the lighting industry and is suitable for conventional process requirements.
For the soldering scenario of copper wire lamps with temperature-sensitive crystal oscillators, the LFP?2RTHL?Sn64Bi35Ag1 medium-temperature solder paste solution demonstrates excellent soldering performance and reliability. Its unique alloy composition and process adaptability effectively solve problems in traditional soldering such as high void rate and poor solder climbing effect, providing for precision electronics
LFP?5RW1A?Sn42Bi58 water-washable low-temperature solder paste is specifically designed for nickel-plated aluminum fins of heat sinks. It leaves no residue after soldering, meets high-precision soldering requirements, and offers excellent water-wash performance and cost advantages. It is suitable for high-demand scenarios such as telecommunications and consumer electronics.
LFP?5RW5?0307 special water-wash solder paste provides solutions for the challenges of soldering aluminum and stainless steel. Its unique formula and process parameters effectively improve soldering quality, making it suitable for SMT production scenarios involving complex metal materials.
The selection of LFP?5RW1?305 water-washable high-temperature solder paste should be based on water washing process requirements and soldering temperatures, to ensure that residues are water-washable and meet high-activity demands. It is suitable for complex packaging scenarios such as QFN/DFN. During selection, attention should be paid to the matching between alloy powder particle size and post-soldering performance.
LFP?5RLJ?0307 laser high-temperature solder paste is specifically designed for jet valve laser welding, featuring high activity and low residue. It is suitable for precision dispensing scenarios such as pneumatic valves and screw valves. Its halogen-free formula and stable alloy powder ensure no solder beads during the welding process, improving process reliability and product yield.
From June 17 to 20, 2026, NEPCON Thailand 2026, the most influential annual electronics manufacturing industry event in Southeast Asia, grandly opened at Hall 100 of BITEC International Trade & Exhibition Centre in Bangkok. The exhibition is hosted by Reed Exhibitions UK, and has been deeply cultivated through nineteen editions
Addressing the industry pain point that solder joints on new energy electronic control boards are prone to cracking and have insufficient reliability under high-low temperature cycling conditions, Jiajinyuan has launched a variety of halogen-free and lead-free high-temperature solder pastes, covering segmented scenarios such as high solder climb for QFN/DFN, low void rate, zero halogen, and laser welding. Its 0307, 305 and other alloy systems at 240
All Jiajinyuan solder paste products continue to pass the dynamic and effective control of RoHS, halogen-free, SGS and ISO systems, covering more than ten types of细分 scenarios such as high temperature, medium temperature, low temperature and laser welding. Among them, 8MQP/5RQ series solder paste achieves nearly 100% solder climbing rate for QFN/DFN, 8M9P/
Jiajinyuan LFP series halogen-free solder paste has completed QFN packaging process verification, with the measured solder wetting rate close to 100%, significantly improving solder joint wettability and bridging control capability. Relying on 0307/T4 alloy powder and ROL1 grade low-halogen formula, it maintains high activity while meeting IPC-J-STD-00
Jiajinyuan has significantly improved batch stability and process traceability of solder paste by establishing 21 inspection processes covering the entire workflow from raw material warehousing, alloy powder preparation, solder paste mixing, reflow verification to outgoing inspection. Its halogen-free and lead-free high-temperature solder paste series performs well in key aspects such as QFN/DFN solder climbing rate, residue transparency, and void control
Jiajinyuan has launched a high-stability no-clean solder paste, specifically designed for 01005 micro components. By optimizing the alloy powder particle size distribution (T4/T5), rosin-based flux system, and rheological property control, it significantly improves printing anti-slump performance while maintaining halogen-free and lead-free high-temperature characteristics, meeting the high solder climbing rate requirements for QFN/DFN.
JJY, through its full range of halogen-free and lead-free high-temperature, medium-temperature, low-temperature, and laser-specific solder paste products, strictly controls wastewater and exhaust emissions during production, and realizes closed-loop management of green electronic materials from material formulation and alloy powder grading to rosin/washable processes. Its 12 major series of solder pastes, including 8MQP/5RQ, have halogen
For BGA high-density packaging scenarios, Jiajinyuan's halogen-free, low-void solder paste 8M9P/5RR series has completed production line verification at leading packaging and testing customers. The measured void rate is stably controlled within 3%. After reflow soldering, the solder joints exhibit uniform wetting and a dense, continuous IMC layer, raising the first-pass yield of BGA devices from 92.7%
The Jiajinyuan technical team provides on-site resident services at the customer's SMT production line, conducting full-process diagnosis and process optimization for typical soldering defects such as solder bridging and tombstoning. Relying on precise selection and parameter matching of various halogen-free and lead-free high-temperature solder pastes including 8MQP/5RQ and 8MNTTP/5RNTT, combined with 030
Jiajinyuan 5RLJ laser solder paste is optimized specifically for laser heating soldering scenarios. It adopts a synergistic design of rosin-based systems with multiple specifications of high-temperature alloy powders including 0307/105/305 and 00507BN, delivering stable performance with bright solder joints and no solder ball spattering within the 240–260℃ soldering window. Halogen
