JJY's full range of Solder Paste products currently maintains stable compliance with the RoHS Directive, halogen-free control, SGS third-party testing certification, and the effective operation of the ISO quality management system. All mass-produced models undergo quarterly halogen content retesting and process stability verification. Among them, the 8MQP/5RQ series solder paste achieves an actual solder wetting rate of over 98% on QFN/DFN packaged devices. Combined with 0307/T4 alloy powder and ROL1 rosin-based Flux system, it significantly improves the wetting uniformity of fine-pitch pads and the ability to suppress bridging. The 8MTSP/5RTS series controls the total halogen content within 500ppm, with transparent and minimal residue and an ionic contamination value lower than 0.7μg/cm2 NaCl equivalent, making it suitable for automated production lines with high requirements for post-cleaning compatibility.

For high-precision terminal applications, the 8MNTTP/5RNTT series solder paste further reduces halogen to the 100~200ppm ROL0 level. It adopts a synergistic design of 00507BN/T5 ultra-fine spherical alloy powder and low-volatility rosin carrier, achieving a comprehensive performance of void rate below 3% and solder joint thrust ≥8.5N in the soldering of tablet computer motherboards, 5G base station RF modules, and folding screen hinge FPCs. Meanwhile, the two zero-halogen products, 8M9P/5RR and 5RG, correspond to high-temperature and ultra-low-temperature process windows respectively.

To meet differentiated process requirements, JJY simultaneously provides a matrix of water-washable and laser-specific solder pastes. The 8MW1P/5RW1 and 8MW1AP/5RW1A series can be completely removed with pure water rinsing after soldering aluminum nickel-plated heat dissipation fins, reducing costs by approximately 22% compared to traditional no-clean solutions. The 5RLJ and 5RLJB laser solder pastes are adapted to the high-precision dispensing rhythm of pneumatic valves, screw valves, and jet valves. Their T6/T7 grade ultra-fine alloy powder has a particle size distribution Dv50≤12.5μm, combined with <500ppm>

In terms of alloy systems, JJY has formed a complete lead-free alloy spectrum covering Sn96Ag4 to In40.2Sn20.7Bi39.1. Among them, the four main alloy powders, 0307, 305, 64351, and 4258, maintain a melting point fluctuation within ±1.5℃ in the mainstream reflow range of 240~260℃. The T3 to T7 multi-level powder classification strategy ensures that the thixotropic index of solder pastes with different viscosities is stably maintained in the range of 4.2~5.8. All models have passed 200 temperature cycles (-40℃~125℃) and 1000 hours of 85℃/85%RH high-humidity storage verification under the JEDEC J-STD-005B standard, ensuring that the viscosity change rate of the solder paste does not exceed ±8% and the slump height deviation is less than 0.15mm within the 12-month storage period.

Currently, JJY's Solder Paste Production line implements a three-level quality control mechanism: retaining samples for 36 months per batch, submitting full-parameter test reports to SGS quarterly, and undergoing ISO 9001:2015 surveillance audits semi-annually. Main models such as LFP-JJY5RQ-305 and LFP-JJY5RR-0307 have entered the qualified supplier lists of leading domestic EMS enterprises, and have completed batch introduction in customers in new tracks such as new energy vehicle OBC, industrial servo drives, and AR glasses optical modules. The proportion of halogen-free solder paste shipments in the company's total solder paste sales has remained above 87% for three consecutive quarters.