SMT Solder Paste Manufacturers.
Focused on SMT soldering processes, a one-stop electronic soldering solutions provider.
Here you can find knowledge about Tin Ingot, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Poor sphericity of solder powder in solder paste significantly reduces print forming rate, leading to high-frequency defects such as missing printing, solder bridging, and misalignment, which is particularly prominent on 0201 and smaller package devices. Non-spherical solder powder has poor fluidity, high rolling resistance, and increased friction with the stencil aperture walls, directly affecting solder paste release rate and demolding consistency.
Published: 2016-05-12In SMT printing, the rheological properties of solder paste directly affect continuous printing stability. An excessively high thixotropic index easily leads to poor demolding and edge pinholes, while an excessively low thixotropic index causes slump and aperture clogging. Jiajinyuan solder paste achieves precise control of the viscoelasticity ratio. Under 25°C environment and 0.5mm stencil conditions, the measured thixotropic index is 1.8～2.3. Combined with the parameter set of squeegee pressure 2.8kg and speed 45mm/s, it can continuously complete 1200 PCBs without aperture clogging.
Published: 2016-04-10Excess solder is a core defect causing short circuits, bridging and cold solder joints in fine-pitch IC production, and its occurrence is strongly coupled with stencil aperture design, squeegee pressure, solder paste rheological properties and reflow parameters. Production line data from Jiajinyuan shows that over 63% of solder defects caused by excess solder are directly associated with solder paste printing thickness exceeding the standard by more than 0.02 mm, and strict control of excess solder has become a rigid threshold for improving the yield of CSP and QFN 0.4 mm pitch devices.
Published: 2016-02-04BGA chip reballing repair relies on precise reballing processes. Jiajinyuan's dedicated solder paste works in synergy with matching solder balls to ensure solder joint coplanarity, tensile strength, and void rate meet standards. This solution has been verified on multiple production lines to stably pass 500 cycles of -40℃~125℃ thermal shock without defects such as solder bridging, cold solder joints, or ball misalignment.
Published: 2016-01-29The use of T5/T6 ultra-fine solder paste in the ball mounting process can significantly improve the consistency of solder ball formation and edge retention, addressing issues such as easy edge collapse, poor sphericity, and height dispersion commonly associated with traditional solder pastes. It is particularly suitable for micro-pitch BGA ball mounting below 0.3mm and high-density packaging scenarios.
Published: 2015-12-17SMT quality control requires regular oven temperature testing to verify reflow soldering stability, combined with 100% automatic identification of solder joint appearance defects via AOI, and periodic sampling inspection of internal voids and cold solder joints in BGA and QFN via X Ray. The three work in coordination to form a three-dimensional defense line covering thermal processes, apparent quality and hidden defects, ensuring the consistency of mass production batches.
Published: 2015-09-21Pre-tinning OSP pads places extremely high demands on the wettability of solder paste. Low-residue, highly active, and highly penetrating OSP solder paste must be selected; otherwise, cold solder joints, tombstoning, and poor wetting are likely to occur. In actual production lines, common problems mostly stem from insufficient reaction between the solder paste and the OSP coating, failure of the flux to break through the coating in time during reflow, or printing misalignment caused by a mismatch between the metal content and viscosity of the solder paste.
Published: 2015-09-13The no-clean and water-washable formulations for PCBA soldering materials need to balance ionic residue control and post-soldering surface cleanliness. The Jiajinyuan series formulations achieve stable performance with rosin-based residue <0.5μg/cm2 and halogen content <0.1wt% in actual production lines, meeting the process requirements for high-density PCBA soldering materials for 01005 components and 0.3mm pitch BGA.
Published: 2015-09-05Reliability testing of PCBA for medical communication applications must comply with stringent standards such as IEC 60601-1 and AAMI TIR18. Its PCBA reliability test items cover temperature cycling, highly accelerated life testing, vibration and shock, and damp heat with bias. For each test, stress parameters must be set based on real production line failure data. Production line measurements by Jia Jinyuan show that for BGA solder joints, a cracking rate exceeding 3% after 500 temperature cycles from -40°C to +85°C is deemed a process red line.
Published: 2015-06-27To address the persistent issues of solder paste and solder powder splashing and frequent tiny solder beads around small components on SMT production lines, this solution adopts a five-dimensional coordinated approach covering solder paste selection, stencil aperture design, squeegee parameters, printing pressure, and reflow soldering temperature profile. By adjusting solder paste viscosity and metal content to match the mounting requirements of 0201/01005-level components, and precisely controlling the peak reflow temperature of the solder paste within the range of 235±2℃, the measured solder bead defect rate has been reduced from 3200ppm to below 170ppm.
Published: 2015-02-16Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.