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The selection of eutectic solder must closely focus on the two key hard indicators of melting point and ductility, as the melting point directly determines the width of the reflow profile window, while ductility affects the thermal fatigue resistance of solder joints. Jia Jinyuan's Sn63Pb37 eutectic solder melts precisely at 183℃ with an elongation rate stably above 45%, making it a reliable choice for mass production of automotive controllers and industrial power boards.
Published: 2018-08-13Based on real cases from SMT production lines, this paper details the verification methods for the insulation performance of the no-clean solder paste process, covering three core solder paste testing methods: ionic contamination testing, surface insulation resistance (SIR) testing, and post-reflow ICT open-circuit retesting. It emphasizes the direct impact of no-clean solder paste residues on the risk of leakage between micro-pitch solder joints under BGA packages.
Published: 2018-07-14The process window setting for lead-free solder paste reflow soldering must balance the coordinated control of peak temperature and soaking zone. Jia Jinyuan lead-free solder paste performs stably in the peak temperature range of 235°C to 245°C. However, if the soaking zone temperature is below 150°C and the duration is less than 60 seconds, it can easily lead to poor wetting and increased void rate. In actual production lines, the conveyor speed and the power of each temperature zone need to be dynamically adjusted based on the measured curves from a temperature profiler.
Published: 2018-06-18The sphericity, particle size distribution, and oxidation level of tin powder particles in SAC solder paste directly affect the release integrity and pad coverage during solder paste printing. Actual production lines have found that spherical tin powder with a D50 of 25μm can achieve a release rate of over 92% on a 38μm aperture stencil. When the D50 deviation exceeds ±1.5μm or the oxygen content is >0.5wt%, the defect rates of solder bridging and insufficient solder increase by more than 3 times. The process compatibility of solder paste, SAC solder paste, and tin powder solder paste must be based on measured particle parameters.
Published: 2018-04-13During PCB pad processing, the soldering performance of ENIG, Immersion Silver and OSP processes differs significantly. The ENIG layer is oxidation-resistant but has poor wettability, requiring high-activity solder paste. Immersion Silver is prone to sulfidation discoloration and sensitive to reflow peak temperature. Uneven OSP film thickness can cause local non-wetting. The three processes must be managed differentially in stencil aperture design, reflow profile setting, and incoming material storage conditions.
Published: 2018-04-13During the pin dip soldering process, oxidation of the solder bath surface is the main cause of continuous dross generation. Jiajinyuan anti-oxidation flux, through the synergistic effect of dynamic coverage and active ingredients, forms a dense inert film on the solder bath surface, reducing the oxidation rate by more than 70% during pin dip soldering, cutting daily dross production by 1.2kg, significantly extending the cleaning cycle of the solder pot, and stabilizing solder joint wettability.
Published: 2018-03-2401005 packaged components, with their extremely small pad dimensions and narrow solder paste volume tolerance, are a high-incidence area for solder beads. Residual solder beads can easily cause creeping discharge and breakdown during high-voltage testing, directly threatening the insulation reliability of products. Production line data from Jiajinyuan shows that this type of defect accounts for 68.3% of the total solder bead incidence, requiring coordinated control from three aspects: stencil aperture design, squeegee pressure, and reflow atmosphere.
Published: 2018-02-20To address persistent issues such as uneven solder paste deposition, cold soldering, and solder bridging during thick copper foil soldering on multilayer boards, this paper draws on 20 years of measured data from Jia Jinyuan's production lines, focuses on precise solder paste dosage control methods, and details the matching logic for thick copper solder paste printing parameters, covering key actions such as stencil aperture design, squeegee pressure and speed coordination, and SPI detection threshold setting before reflow soldering.
Published: 2018-02-09High-voltage and insulation testing in PCBA reliability testing is a critical process on the production line for determining whether a circuit board has potential risks of current leakage, creeping discharge, or dielectric breakdown. By applying a specified voltage and monitoring changes in leakage current, it can effectively identify real production line issues such as PCB lamination defects, solder bridging, flux residue, and insufficient cleanliness, providing a hard safety threshold for the delivery to JJY customers.
Published: 2017-11-27In the tin dipping process, the tin dipping time is a key parameter determining the thickness of the terminal tin layer. Excessively long dipping time will lead to an overly thick tin layer, which is prone to oxidation, poor soldering, and abnormal insertion/extraction force. Actual measurements on Jia Jinyuan's production line show that for every 0.5-second increase in tin dipping time, the average tin thickness increases by 8–12 μm. Comprehensive control must be implemented in combination with the base material, tin bath temperature, and flux activity.
Published: 2017-10-14Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.