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Here you can find knowledge about Tin Ingot, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Tombstoning is one of the most persistent soldering defects in SMT production lines. Its root cause lies in uneven heating at both ends of the tombstoned component, which leads to asynchronous melting of the solder paste at the solder terminals and an imbalance in surface tension, subsequently causing one end of the component to be lifted upright. Production line data from Jia Jinyuan indicates that this issue accounts for over 73% in 0402 and 0603 chip resistors and capacitors, and is particularly prone to recurring in nitrogen atmosphere reflow soldering.
Published: 2021-01-05Solder paste is accelerating its replacement of traditional leaded/lead-free systems in low-temperature soldering scenarios. Among them, Sn-Bi solder paste has become the preferred choice for flexible circuits, temperature-sensitive devices, and mixed assembly of dissimilar materials due to its 138°C eutectic point. However, its inherent brittleness and insufficient thermal fatigue resistance lead to frequent solder joint cracking, especially under the combined stress of temperature cycling and mechanical vibration, where its reliability shortcomings become prominent. Engineers need to simultaneously evaluate the device package type, PCB copper thickness distribution, and matching degree of reflow profile slope during selection.
Published: 2020-12-08Using lead-free solder in the tin dipping process can significantly improve the solderability and corrosion resistance of wiring harness connector terminals, meeting RoHS environmental protection requirements. Jiajinyuan SAC305 series lead-free solder achieves uniform coating thickness control of 8-12 μm at a melting point of 183°C, adapting to the cycle time of continuous tin dipping production lines for terminals with wire diameters of 0.3mm-1.2mm.
Published: 2020-09-26
The presence of honeycomb pores on the surface of tin bars is not necessarily a quality defect, and comprehensive judgment should be made in combination with the appearance of solder, smelting process and application scenarios. For example, for tin bars smelted and cast in a low-oxygen environment, if there are only tiny honeycomb pores on the surface layer that do not affect wettability and drawing continuity, they are within the acceptable range. However, honeycomb pores accompanied by oxidation slag, wire breakage or poor tin plating clearly indicate that the internal purity of the tin bar or the degassing process is out of control.
Published: 2020-08-17In fine-pitch pin printing, the pinhead phenomenon directly affects solder paste transfer rate and subsequent placement accuracy. It is necessary to synchronously monitor the length, morphology and repeatability of pinheads during first article inspection, in-process patrol inspection and stencil cleaning. Production line data from JJY shows that for 0.4mm pitch QFN devices, a pinhead exceeding 0.15mm will trigger the risk of solder bridging.
Published: 2020-07-24First article inspection is the first gate for error prevention on the SMT production line. It is necessary to simultaneously verify the consistency between material models and the BOM, the thickness and offset of solder paste printing, the XYθ deviation of placement positions, and whether the temperature and time in each zone of the reflow profile meet the process window of JiajinYuan solder paste. Any inaccuracy in any link will cause irreversible defects such as cold solder joints, tombstoning, or cold soldering in mass production.
Published: 2020-07-12
After solder wire oxidizes, poor soldering wetting and frequent solder breakage during wire drawing occur. Production lines commonly use fine sandpaper for light grinding followed by wiping with anhydrous ethanol to quickly restore the active surface. Storing the solder wire in a constant-temperature moisture-proof cabinet can significantly delay the oxidation process.
Published: 2020-06-04Standardized operations for solder paste replenishment and stirring in high-speed SMT printing production lines directly determine printing yield and equipment utilization. Based on the actual adaptability of Jiajinyuan solder paste at squeegee speeds above 300mm/s, this article details key control points such as replenishment frequency, temperature control window, and manual/automatic stirring parameter settings. All operations have been verified through 72 consecutive hours of production line testing.
Published: 2020-04-09Syringe dispensing solder paste and stencil printing solder paste are often used interchangeably in actual production lines, but differences in their rheological properties can easily cause issues such as needle clogging, stringing, and printing misalignment. Based on JJY's 20 years of on-site SMT experience, this paper focuses on the interchangeability boundaries between dispensing solder paste and printing solder paste, key points for thixotropic index matching, and a coordinated improvement plan for needle clogging based on the three core elements of temperature control, pressure, and cleaning.
Published: 2020-03-22
The tightness of the solder wire winding directly affects the smoothness of solder wire feeding in automatic solder feeders. Excessive tightness easily causes drawing breakage and jamming alarms, while excessive looseness leads to wire jumping, deviation, and even solder breakage. Production line tests show that a winding tension deviation exceeding 15% significantly increases the nozzle clogging rate.
Published: 2020-03-21Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.