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Here you can find knowledge about Tin Ingot, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
To address the frequently occurring issues of solder paste tombstoning, cold solder joints, and poor wetting on OSP gold-plated pads in SMT production lines, and drawing on 20 years of on-site commissioning experience, this paper provides immediately actionable countermeasures from four aspects: solder paste selection compatibility, stencil aperture design redundancy, reflow profile activity window control, and collaborative management of PCB pad surface conditions, directly targeting the root causes of uneven solder paste wetting and cold solder joint defects.
Published: 2023-05-12Solder dross is continuously generated during continuous wave soldering, and its production volume is directly affected by solder pot temperature, conveyor speed, flux activity, and PCB design. Production line data from Jia Jinyuan shows that every 0.5 kg/h increase in dross increment raises the material cost per board by 0.32 yuan. Therefore, dross volume control is not an auxiliary step, but the true cost control center of the wave soldering process.
Published: 2023-05-03The tin dipping process forms a uniform tin layer on the surfaces of wire terminals and electronic component pins, significantly improving oxidation resistance and solderability, and preventing common production line defects such as cold solder joints and weak soldering. Jia Jinyuan tin dipping equipment completes a single dipping within 0.8 seconds, with the tin layer thickness stably controlled at 8-12μm, suitable for various substrates including silver-plated, copper-plated, and bare copper.
Published: 2023-03-27The setting of the constant-temperature segment during the liquid phase time in the solder paste reflow profile directly affects the wettability and void rate of solder joints. In actual production lines, adjustments must be made comprehensively based on the solder paste manufacturer's recommended values, PCB heat capacity distribution, and oven temperature stability. The typical liquid phase time should be controlled between 60 and 90 seconds: too short a time can easily lead to cold solder joints, while too long a time will accelerate the growth of intermetallic compounds and cause component tombstoning or pad peeling.
Published: 2023-03-25
Solder paste printing forming spikes is a high-frequency fault on SMT production lines. The root causes are concentrated in three aspects: mismatch of solder paste rheological properties, unreasonable stencil aperture design, and unbalanced coordination between squeegee parameters and printing speed. The solution requires simultaneous adjustment of solder paste viscosity grade, optimization of squeegee pressure and angle combination, and calibration of stencil support tension and PCB positioning accuracy.
Published: 2023-03-12Running solder samples on machines at an electronics factory is a key action to verify the compatibility of new solder batches with existing SMT production lines. By running small-batch trial production in real environments with stencils, placement machines, and reflow ovens, adaptation issues such as poor printing release, placement offset, and reflow cold soldering can be quickly identified, avoiding rework after the entire batch of materials goes online. The batch stability, thixotropy, and activity of electronics factory solder must be cross-verified through actual production line testing.
Published: 2022-12-25
Jiajinyuan has launched a high-stability no-clean solder paste, specifically designed for 01005 micro components. By optimizing the alloy powder particle size distribution (T4/T5), rosin-based flux system, and rheological property control, it significantly improves printing anti-slump performance while maintaining halogen-free and lead-free high-temperature characteristics, meeting the high solder climbing rate requirements for QFN/DFN.
Published: 2022-12-14Conduct actual measurements on small-batch samples of sensor soldering solder to verify its wetting and spreading performance and void rate control capability under the conditions of 0.3mm pitch micro-pads and gold-plated nickel-palladium-gold surface treatment, with a focus on examining the bridging suppression effect and IMC layer uniformity of Jiajinyuan JH-851A lead-free solder at a peak temperature of 235℃ under a nitrogen atmosphere.
Published: 2022-10-29As a high-frequency industrial by-product generated in SMT production lines, solder dross typically has a tin content of 60% to 75%. Through Jia Jinyuan's dedicated centrifugal separation and low-temperature smelting processes, over 92% of metallic tin can be stably recovered and directly reused in solder paste formulation or wave soldering bath replenishment, reducing the factory's overall tin material loss rate from the traditional 3.8% to within 1.2%.
Published: 2022-10-16To address the issues of large fluctuations in solder paste deposition volume and frequent cold solder joints and solder bridges during high-density PCB solder paste printing, this paper proposes a solder paste volume control method based on measured production line data, with stencil aperture optimization, dynamic calibration of squeegee pressure, and temperature control of solder paste viscosity as its core components. It focuses on solving the challenge of solder paste deposition consistency for 0.4mm pitch QFN and 0201 components, significantly reducing the proportion of abnormal batches where the SPI first-pass yield is below 92%.
Published: 2022-08-17Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.