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Here you can find knowledge about Tin Ingot, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Tombstoning is a frequently occurring soldering defect in SMT placement of small-size resistors and capacitors, which directly reduces the first-pass yield. Production line data from Jiajinyuan shows that tombstoning of 0402/0201 components accounts for 68% of placement defects, mainly caused by solder paste printing offset, mismatched reflow oven temperature profile, and asymmetric PCB pad design.
Published: 2025-06-12Solder sample testing should focus on four practical dimensions: printing accuracy, wetting and spreading capability, void rate control, and solder ball formation tendency. Through methods such as stencil aperture matching verification, post-reflow solder joint morphology observation, X-ray void area statistics, and solder ball counting under a microscope, the adaptation boundaries of Jia Jinyuan solder under different PCB pad designs and process windows can be quickly identified.
Published: 2025-05-15
In manual soldering, the selection of solder wire diameter directly affects drag soldering efficiency and solder joint formation quality. Thick solder wire is suitable for large-area pads and quick solder replenishment but is prone to causing bridging, while thin solder wire facilitates precise pin control but imposes higher requirements on operation rhythm. Actual production lines need to comprehensively weigh factors based on PCB pad size, component spacing, and operation takt time.
Published: 2025-05-11During the soldering rework of gold-plated boards, the gold layer is prone to oxidation by high temperatures or loss due to mechanical scraping, which leads to exposure of the nickel layer on the pad surface, poor wetting, and increased cold solder joints, directly affecting the long-term reliability of gold-plated board soldering. It is necessary to implement coordinated control from three aspects: soldering iron temperature, dwell time, and cleaning method.
Published: 2025-03-09Before the delivery of foreign trade orders, solder sample testing must be conducted. Key parameters such as melting point, wettability, and residual ion content are verified through pre-sampling tests to avoid rejection or returns by overseas customers due to batch differences. Jia Jinyuan's measured data shows that the defect rate of export batches without solder sample testing is as high as 12.7%, while the customer complaint rate for orders following standard sampling procedures is reduced to within 0.3%.
Published: 2024-11-15When soldering communication base station motherboards with high-frequency boards, it is necessary to cope with long-term cyclic working conditions from -40℃ to +85℃. Jiajinyuan optimized solder paste selection, stencil aperture compensation, and segmented temperature control of the reflow soldering profile, reducing the solder joint void rate to ≤8%. After 2000 thermal shocks, the impedance fluctuation remains <3%, ensuring the stability of 5G millimeter-wave signal transmission.
Published: 2024-10-14Tombstoning is one of the most common defects in SMT solder paste printing. When the stencil thickness does not match the pad design, the solder paste is easily pulled up during the demolding stage, forming pointed residues. If the printing speed is too fast at this time, the shear stress superimposed on the demolding tension will significantly aggravate the degree of tombstoning, leading to subsequent placement offset, reflow bridging, and even cold solder joints.
Published: 2024-09-02SMT printing is a key process in which SMT stencils evenly transfer solder paste to PCB pads, directly affecting placement accuracy and reflow soldering yield. In actual production lines, solder paste viscosity, stencil aperture size, squeegee pressure, and printing speed must be coordinated and matched; any slight deviation will cause typical defects such as insufficient solder, solder bridging, or misalignment.
Published: 2024-07-28Tin whisker growth after solder paste reflow is a critical failure mode affecting solder paste reliability. Its root causes are closely related to the silver content, grain size, flux residue, and intermetallic compound growth kinetics in the solder paste formulation. By precisely regulating the Sn/Ag/Cu ratio in the solder paste formulation, adding trace inhibitory elements, and optimizing the thermal stability of the flux, the whisker initiation time can be significantly delayed.
Published: 2024-06-30Automotive electronic solder maintains the mechanical strength of solder joints within a wide temperature range of -40°C to 150°C, and shows no microcracks after random vibration tests at 20G acceleration and 10Hz–2kHz, meeting the dual requirements of temperature resistance and vibration resistance for automotive electronic solder in high-reliability scenarios such as ADAS controllers and BMS main control boards.
Published: 2024-06-29Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.