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Tombstoning causes spike-like protrusions at the edges of solder paste deposits. During placement, component pins are easily pushed off position or pressed into the stacked solder paste area. During reflow, the fluidity of molten solder paste increases, sharply raising the risk of bridging. The Jiajinyuan G-8800 series solder paste is most prone to exposing this defect under conditions of a 35μm stencil and a 45° squeegee angle.
Published: 2022-08-06Unreasonable reflow soldering temperature curve settings will significantly aggravate typical defects such as voids and solder balls. Excessively fast preheating ramp-up causes the flux to boil violently and splatter, forming solder balls. Insufficient soaking or low peak temperature leads to poor solder wetting and hinders gas escape, inducing voids. Actual measurements on Jiajinyuan production lines show that when the ramp rate exceeds 3℃/s or the reflow time is less than 60 seconds, the BGA void rate generally rises above 15%.
Published: 2022-06-27The pin dip soldering lead-free alloy process, by precisely controlling dip soldering temperature, time, and alloy composition ratio, effectively avoids the ROHS compliance risks of traditional lead-containing processes. It has been stably operating on multiple export production lines of JJY for over three years, with its solder joint wettability, thermal fatigue resistance, and surface gloss all meeting the requirements of the IEC61191-2 standard.
Published: 2022-02-12High-tack solder paste effectively addresses solder paste collapse, component misalignment, and even component drop-off issues on SMT production lines caused by planned downtime, equipment failures, or line changeovers by enhancing the initial adhesion strength and high-temperature tack retention of surface-mount solder paste. It is particularly suitable for ultra-small components such as 0201 and 01005, as well as double-sided reflow processes. Its tack can be maintained for more than 4 hours at room temperature and remains stable in a 60°C environment, avoiding the significant tack decay that occurs in traditional solder paste after only 1.5 hours of downtime.
Published: 2022-01-27During the pin dip soldering process, by precisely controlling the dip soldering time, temperature and flux activity, the pin dip tin thickness can be effectively controlled between 0.03mm and 0.08mm, avoiding pin adhesion and bridging defects caused by an excessively thick tin layer. Measured data from the Jiajinyuan production line shows that after reducing the dip soldering time from 5 seconds to 3.2 seconds, the bridging rate decreased by 67%. This method has been batch-verified in the pre-treatment stage of DIP plug-in wave soldering.
Published: 2021-10-20Poor wetting of the bottom pad during QFN soldering often leads to cold solder joints or voids. By changing the stencil aperture from the conventional 1:1 to a 0.92:1 trapezoidal scaling design, JJY significantly improves the solder paste transfer rate without increasing the amount of solder. Combined with the coordinated control of squeegee pressure at 0.45 MPa and speed at 45 mm/s, the wetting area of the QFN soldering bottom pad is increased from 68% to 91%, and the measured solder joint void rate is below 12%.
Published: 2021-09-26The control of the dwell time of the OSP board welding production line is directly related to the chemical stability and solderability of the OSP film layer. If the exposure time of the PCB from the spray OSP treatment to before reflow soldering exceeds 48 hours, or if it stays in a high-temperature and high-humidity environment (such as RH > 60%, T > 25°C) for more than 24 hours, the film layer is prone to hydrolysis and oxidation, which will cause the solder joint void rate to increase by more than 12% and the wetting angle to increase to more than 45°. Actual measurements on the Jiajinyuan production line show that this problem accounts for 67% of the solder bridging defects in OSP board welding.
Published: 2021-07-09To meet the demand for solder exports for ASEAN foreign trade, Jia Jinyuan provides a full range of supporting supply solutions for solder paste, solder wire, and solder bars, covering the process windows of mainstream SMT production lines in Vietnam, Thailand, Malaysia, and other countries. The viscosity, metal content, and reflow activity of the solder paste have passed the dual verification of ASTM F2389-22 and JEDEC J-STD-005, ensuring stable printing and soldering for components ranging from 01005 to QFN48.
Published: 2021-05-10The solder paste optimization corresponding to the generation mechanism of tiny solder balls focuses on the dynamic coupling relationship among solder paste, solder ball solder paste, and solder paste reflow. By regulating the particle size distribution and sphericity of metal powder in the solder paste, the volatilization gradient of the flux, and the viscosity decay curve, the generation of 0.1～0.3mm tiny solder balls is significantly suppressed without sacrificing printing accuracy, and PPM-level defect reduction has been achieved in multiple automotive electronics production lines.
Published: 2021-02-27
The global supply chain volatility in 2020 significantly impacted solder paste supply, prompting some manufacturers to accelerate localized production layouts to cope with market uncertainty. Industry trends show that demand for solder paste continues to grow, but supply stability faces challenges, and enterprises need to strengthen localized capabilities and industrial chain coordination.
Published: 2021-01-08Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.