When we shipped the first batch of Solder Paste to our customer in Ho Chi Minh City, Vietnam, we found that temperature and humidity fluctuated significantly in the local cleanroom: RH was 45% in the morning and jumped directly to 72% in the afternoon. If the paste were left uncovered for two hours under conventional domestic storage conditions, the squeegee would fail to move after opening, and the stencil clogging rate would soar to 18%. Therefore, JJY SN100C solder paste must be placed in a constant-humidity cabinet 24 hours in advance and controlled at RH 55±3%. Combined with viscosity retesting three times per shift (Brookfield LVDV-II+, 25°C, SP-4 rotor, 12 rpm), this ensures that the printing yield remains above 99.3% for 8 consecutive hours.

The factory in Rayong, Thailand, reported unstable wire feeding. On-site disassembly of the feed roller revealed that the outer diameter tolerance of the Solder Wire exceeded ±0.02 mm, causing clamping slippage. We immediately replaced it with JJY Φ0.8 mm solder wire, with the measured outer diameter controlled between 0.792 and 0.798 mm. After adjusting the wire-feed pressing force to 2.3 N, the spatter rate dropped from 7.6% to 0.9%, and the solder joint wetting angle stabilized at 28°±3°, fully meeting the IPC-A-610G Class 2 standard.

A customer in Penang, Malaysia, originally used local Solder Bars with the furnace temperature set at 255°C, resulting in insufficient solder climb height of less than 0.3 mm on the backside of the PCB after wave soldering. We switched the JJY Sn63Pb37 solder bar to Sn96.5Ag3.0Cu0.5, simultaneously lowered the solder pot temperature to 248°C, and increased the chain speed by 0.8 m/min. The IMC layer thickness of solder joints increased from 1.2 μm to 2.1 μm, while the AOI false alarm rate decreased by 41%. This is because the high-silver solder bar has a surface tension 14.7 mN/m lower than traditional solder bars at 248°C, which is more conducive to capillary filling of fine-pitch pins.

All solder paste batches shipped to ASEAN are accompanied by original factory inspection reports, including three hard indicators: DSC curve peak temperature, powder particle size distribution D50=22.3 μm, and rosin residue <0.012 mg/cm². No third-party inspection is accepted. Each spool of solder wire is marked with the production date, furnace number, and measured tensile strength (≥38.6 MPa). Each solder bar ingot is engraved with a batch code and laser-etched with oxygen content ≤0.0015 wt%. These data are not for factory audit compliance, but serve as the basis for quickly verifying process boundaries during line material changeovers.

Last week, during trial production at a new factory in Phnom Penh, Cambodia, they used another brand of solder paste to print 0201 resistors, and SPI showed a volume deviation of ±14%. We brought JJY SG-880 solder paste, adjusted the squeegee pressure to 6.2 kg, speed to 45 mm/s, and release distance to 0.12 mm, and the CPK stabilized at 1.42 for three consecutive hours. The key is that the spherical powder proportion in the solder paste is 92.7% and the oxidation rate is <0.18%, unlike some low-cost solder pastes mixed with more than 20% flake powder, which collapse and cause solder bridging once reflowed.