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Solder auxiliary materials are indispensable supporting consumables in the PCBA soldering process, among which flux and PCB cleaning solvent directly affect soldering wettability, residue control and subsequent reliability. The Jiajinyuan series flux is compatible with 0201 to QFN0.4mm pads in SMT reflow soldering and wave soldering scenarios. Its rosin-based active ingredients take effect at 150℃ and complete activation at 235℃. When used with Jiajinyuan halogen-free PCB cleaning solvent, the ROSE method ion contamination value can be achieved <0.78μg/cm2.
Published: 2019-12-02When delivering foreign trade orders, solder manufacturers must provide complete inspection documents simultaneously, including SGS reports, RoHS/REACH compliance certificates, measured melting point and wettability data, batch shipment inspection records, and packaging and transportation temperature and humidity monitoring records. These documents directly determine customer customs clearance efficiency and production line first-pass yield. Jia Jinyuan solder manufacturer has embedded standardized inspection documents into its ERP delivery process.
Published: 2019-10-04Cleaning the furnace chamber during daily maintenance of reflow ovens is a key measure to prevent carbonized flux residue from contaminating PCB surfaces. Operations must account for the softening characteristics of residues under a nitrogen atmosphere, the matching degree between chain speed and temperature zone settings, and the unique furnace chamber structural design of Jiajinyuan reflow ovens, to avoid carbon buildup in high-temperature zones that could cause continuous surface yellowing or solder bead defects.
Published: 2019-08-11When soldering thick copper PCBs and multilayer boards with BGA, the significantly increased thermal capacity means conventional heating parameters can easily cause cold solder joints or chip warpage. It is necessary to specifically extend the preheating time, increase the temperature of the soaking zone, and slow down the peak heating slope to ensure synchronous melting of solder balls and overall thermal balance of the PCB.
Published: 2019-04-12The tin dipping process uses tin bars for molten tin to achieve batch tinning of terminals. The key is to control the tin bath temperature at 255±3℃, the tin dipping time at 3.5±0.5 seconds, and the lifting speed at 120±10mm/min. Jiajinyuan tin bars have a tin content of 99.3% and a total impurity content ≤0.05%, which can effectively suppress dross formation and ensure the wetting angle of terminal solder joints is <30°.
Published: 2019-02-05Prolonged standing after solder paste placement causing solder paste displacement is a high-frequency abnormality on SMT production lines. The root cause lies in the continuous collapse and wetting spreading of the placement solder paste at room temperature, compounded by multiple factors such as component self-weight, vibration disturbance, and PCB micro-warpage deformation, which gradually causes the solder paste on the pads to lose its anchoring force on the components.
Published: 2019-01-24Thermal cycling testing is a key method for PCBA reliability testing. Through harsh conditions of -40℃ to +125℃, temperature rise and fall completed within 5 minutes, and a 15-minute dwell per cycle, it simulates temperature stress changes of products in real environments, focuses on exposing microcracks in solder joints and fatigue failure of the IMC layer, and directly reflects the impact of SMT placement processes and reflow profiles on long-term service life.
Published: 2018-12-26Aiming at the common edge collapse problem in solder paste printing for thick boards, this paper starts with the collaborative optimization of solder paste rheological properties, stencil aperture design and squeegee parameters, proposes a solder paste selection standard for thick boards adapted to PCB thicknesses above 0.8mm and a tightening scheme for the solder paste printing process window, and emphasizes that yield improvement can be achieved through solder paste viscosity gradient matching and fine-tuning of the standing time before reflow without replacing equipment.
Published: 2018-11-19Post-printing solder paste placement failure and downtime stencil cleaning time directly determine the SMT first-pass yield. If solder paste remains on the stencil for more than 15 minutes, obvious slump, oxidation, and viscosity increase will occur. If stencil cleaning is delayed for more than 30 minutes after downtime, dried residual solder paste will cause solder spikes and insufficient solder in the next batch of printing. The production line must dynamically set the effective window after solder paste printing and the stencil cleaning response threshold based on solder paste type, workshop temperature and humidity, and printing frequency.
Published: 2018-10-03Due to the large heat capacity and slow heating rate of thick copper plate welding, wave soldering is prone to missing solder. Selecting high-wettability solder bars can significantly improve the spreading ability of molten solder on thick copper substrates. Combined with the collaborative optimization of process parameters such as increasing the preheating temperature to 130℃～140℃ and reducing the chain speed to 1.0m/min～1.2m/min, it effectively solves problems such as insufficient solder joints, bridging defects, and cold solder on the back of the PCB.
Published: 2018-08-29Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.