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In PCBA reliability testing, vibration testing must accurately reproduce the wide-band, high-acceleration, multi-axis coupled operating conditions in energy storage vehicle environments. Production line tests conducted by JJY show that performing only sinusoidal frequency sweep per the IEC 60068-2-6 standard will miss microcracks in solder joints and BGA cold solder joints. It is necessary to superimpose random vibration spectra and three-axis synchronous excitation to effectively expose structural weak points in PCBA reliability testing.
Published: 2017-09-26In the entire chip soldering process, the precision of solder paste printing via SMT stencil directly determines the yield of subsequent component placement and reflow soldering. The viscosity, particle size, and metal content of the solder paste, as well as printing parameters such as squeegee pressure, speed, and release distance, must be coordinated and matched with the actual conditions of the production line. Any mismatch will cause typical defects such as insufficient solder, solder bridging, and misalignment.
Published: 2017-09-07During the soldering process of OSP boards, pad oxidation is the main cause of cold solder joints and poor wetting. Reasonably setting the reflow profile can effectively suppress copper surface oxidation, with the key being to control the heating rate, shorten the high-temperature exposure time, and ensure the peak temperature accurately falls within the 195℃~210℃ range. Production line verification by Jiajinyuan shows that when the TAL time exceeds 60 seconds or the peak temperature exceeds 212℃, the decomposition of the OSP film accelerates, and the risk of pad oxidation increases sharply.
Published: 2017-08-04During the BGA welding rework and ball mounting process, the molding stability of solder paste directly determines the ball mounting yield and subsequent reflow soldering reliability. Jiajinyuan solder paste demonstrates excellent anti-offset capability in 0.3mm pitch BGA ball mounting. The synergistic control of its thixotropic index and pre-reflow collapse amount keeps the center offset of the solder balls stably controlled within ±15μm.
Published: 2017-05-28SMT stencils are core consumables in the SMT solder paste printing process. Their aperture size, thickness, surface treatment, and tension state jointly determine the stability of solder paste transfer volume. Jiajinyuan SMT stencils, through laser cutting precision control and electropolishing process optimization, achieve a solder paste transfer rate of over 92% at a thickness of 0.12mm, effectively suppressing common high-frequency production line defects such as insufficient solder, solder bridging, and edge burrs.
Published: 2017-04-18To address the unstable yield of 0.4mm and below fine-pitch solder paste printing, this paper, based on 20 years of measured data from the Jiajinyuan production line, clarifies that the stencil aperture ratio needs to be dynamically adjusted within the range of 75% to 85%. Among them, 82% is recommended for QFN0.4mm, and it must be reduced to 76% for BGA0.3mm. It is also pointed out that an aperture ratio deviation exceeding ±3% will cause solder bridging or insufficient solder. The core lies in balancing the solder paste release rate and the stencil demolding capability.
Published: 2016-11-09For the export of 5G equipment solder, a full set of inspection documents compliant with IEC 61190-1-1, JIS Z 3284 and RoHS 2.0 requirements must be provided simultaneously, covering solder composition reports, melting point curves, wettability tests, halogen content, intermetallic compound thickness and tin whisker growth assessment. All export batches of Jia Jinyuan are subject to full-item third-party testing by SGS or CTI in accordance with customer-specified standards, with original data attached.
Published: 2016-11-08
Wave soldering bar selection must closely align with actual production line performance. Sn99.3Cu0.7 solder bars are low-cost with acceptable oxidation resistance, but have weak wetting force. Silver-containing alloys improve fluidity and solder joint strength, but significantly increase costs. The differences between the two are particularly prominent in high-temperature continuous operation, fine-pitch through-hole soldering, and lead-free compatibility. Engineers must comprehensively determine the applicable boundaries of SnCu solders based on board thickness, component density, and rework rate.
Published: 2016-10-30To address the frequent occurrence of batch SMT defects, this paper proposes a practical method based on coordinated troubleshooting across three key stages: solder paste printing, placement offset, and reflow profile. By leveraging rapid microscopic comparison, first-article parameter traceability, and cross-validation of measured reflow temperature data, the root cause can be identified within 30 minutes, significantly reducing production line downtime and effectively controlling the spread risk of SMT defects.
Published: 2016-10-12The pricing method and process for solder paste and solder dross recycling are directly related to m
Published: 2016-05-18Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.