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SMT solder paste selection must closely align with the actual pain points of the production line. Domestic solder pastes vary significantly in QFN solder wetting rate, halogen residue, void control, and laser welding compatibility. The 8MQP/5RQ series achieves nearly 100% solder wetting, the 8M9P/5RR zero-halogen variant matches the high-heat scenarios of automotive lighting, and the water-washable 8MW5/5RW5 meets the welding needs of both stainless steel and aluminum materials. The alloy powder grade (T3-T7), halogen grade (ROL0 to ROL1), and temperature window of placement solder paste must be strictly matched with equipment capabilities and product reliability requirements.
Published: 2009-06-04Halogen-free solder paste must balance ROHS compliance and solder wetting reliability in high-precision electronic assembly. The 8MQP/5RQ series launched by domestic solder paste manufacturer Jia Jinyuan has individual halogen content <900ppm and a solder wetting rate close to 100%. The 8MNTTP/5RNTT series has halogen content as low as 100~200ppm with transparent residue. Paired with T3-T5 alloy powders such as 0307/305, it has been verified to stably pass ROHS solder paste certification requirements in the mass production of QFN/DFN devices and communication terminals.
Published: 2009-05-25To address pain points such as prolonged printing without drying, solder paste slump, and poor solder wetting on SMT production lines, this domestically produced solder paste uses a rosin-based formula combined with 0307/T4 alloy powder. Within a reflow window of 240–255℃, it achieves nearly 100% solder wetting rate for QFN/DFN packages, with a halogen content below 900ppm and transparent residue. It balances printing stability and soldering reliability, making it a cost-effective choice as an alternative to imported printing solder paste, SMT solder paste, and domestic solder paste.
Published: 2009-05-23Continuous printing solder paste directly affects yield and line changeover efficiency in SMT production lines. Based on measured data from 12 domestic solder paste series of JJY, this paper compares halogen-free grades, alloy powder types, solder climbing capability and residue characteristics, focusing on analyzing the performance differences between the 8MQP/5RQ high-activity models and the 8M9P/5RR zero-halogen low-void models in QFN continuous printing, to provide reusable process window judgment criteria for SMT solder paste selection.
Published: 2009-05-05Addressing the printing challenges of 0201 small components, domestic solder pastes need to balance the high-resolution transfer rate and low voiding rate of fine-powder solder pastes. Two 0201 solder pastes, Jiajinyuan LFP-JJY5RNTT-0307 and LFP-JJY5RR-0307, are recommended. The former contains 00507BN/T5 fine powder with 100~200ppm halogen, suitable for high-precision consumer electronics. The latter is halogen-free ROL0 grade with T4 powder, featuring outstanding thermal cycling reliability, and has achieved 98.7% solder joint coverage on mobile phone motherboard production lines.
Published: 2009-04-23To address the mounting challenges of 01005 micro components, domestic solder paste brands have achieved stable printing and solder wetting of high-density solder pastes in openings below 0.3mm through the synergistic optimization of T4/T5 grade ultra-fine alloy powder, ROL0 grade ultra-low halogen control, and rosin-based active systems. Among them, the 8MNTTP/5RNTT series achieved over 92% solder joint coverage in actual tests on mobile phone motherboards, significantly outperforming conventional T3 powder solutions.
Published: 2009-04-21Domestic solder paste that resists oxidation and maintains long-term stability once opened is designed for high-frequency lid opening and intermittent printing scenarios on SMT production lines. It adopts a ROL0 zero-halogen rosin-based formula and a T4/T5 fine powder alloy system, significantly improving the shelf life and printing lifespan of antioxidant solder paste series such as 8MQP/5RQ and 8MNTTP/5RNTT. It achieves nearly 100% solder wetting rate for QFN packages while ensuring clear post-reflow residue, making it a high-reliability choice for replacing imported SMT solder paste and reducing oxidation risks of domestic solder paste.
Published: 2009-04-13Solder paste samples must be selected based on actual production line requirements. Domestic solder pastes already have the capability to replace imported ones in terms of QFN solder climbing rate, halogen control, and adaptability to special processes. SMT solder paste selection should prioritize matching device packaging, reflow window, and cleaning requirements. For example, the 8MQP/5RQ series achieves nearly 100% solder climbing for high-density QFNs, while the 8M9P/5RR is suitable for low-void sensitive scenarios such as automotive lighting.
Published: 2009-04-11Poor solder wetting on pads often stems from insufficient solder paste activity, unreasonable alloy powder particle size distribution, or halogen residue inhibiting wetting. This domestic solder paste, through the synergistic optimization of 0307/305 alloy powder T4 fineness, ROL0 ultra-low halogen (<500ppm) and rosin-based carrier, significantly improves the QFN/DFN solder climbing rate to 70%–90%, and is a cost-effective solution to replace imported SMT solder paste and achieve stable mass production of solder paste with good solderability.
Published: 2009-03-28The spherical solder paste made from spherical tin powder of domestic solder paste brand Jiajinyuan performs outstandingly in practical test scenarios such as nearly 100% solder climbing rate in QFN/DFN, extremely low void rate, transparent residue and water washability. Its series including 8MQP/5RQ, 8M9P/5RR, 8MW1P/5RW1 all adopt T3/T4 grade high-sphericity 0307/305 alloy powder, which meets the process requirements of high-speed printing solder paste, and satisfies the stringent requirements of automotive electronics, communication terminals and precision consumer electronics for forming effect and reliability.
Published: 2009-02-24Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.