Our JJY LFP-JJY5RQ-0307T4 halogen-free and lead-free high-temperature Solder Paste has been verified on the production line. It can maintain complete solder paste transfer at the stencil aperture even at a printing speed of 600mm/min. This is because the sphericity of its 0307 alloy powder is controlled above 92%, the particle size distribution D50 is 25±2μm, and the oxygen content is below 1200ppm. Combined with the rosin-based ROL1 Flux system, the wetting rate of the printed solder paste on QFN 0.4mm pitch devices stably reaches about 98%, while the conventional T3 powder version only reaches 72%～78% under the same conditions.

When the 8M9P/5RR zero-halogen series is used for reflow of automotive lamp modules, the measured solder joint void rate is below 3.5%, which is far better than the 5.2%～6.8% of imported products of the same specification. The reason is that the 0307T4 powder has a thinner surface oxide film and stronger melting fluidity. In addition, ROL0 level halogen control (0ppm) avoids abnormal growth of intermetallic compounds, which is particularly critical for LED driver boards with strict heat dissipation requirements. This solder paste was used to continuously run 200 batches without solder joint cracking or excessive IMC layer thickness.

For welding of aluminum-based heat sinks that require no white residue after water cleaning, the LFP-JJY5RW5-0307 water-washable solder paste meets the standard after one cleaning under the conditions of spray pressure 0.25MPa and water temperature 45℃. The conductivity of the residue is <2.5μS/cm, which improves the cleaning efficiency by 40% compared with traditional rosin-based solder paste. The fundamental reason lies in the synergistic optimization of the sphericity of the SC07 and 0307 mixed powder, which not only ensures the release property of the printed solder paste, but also makes the flux carrier easier to be penetrated and peeled off by water molecules.

In laser welding scenarios, the LFP-JJY5RLJ-305 solder paste has a dispensing consistency CV value ≤3.1% when dispensed by a jet valve, with no solder balls and no spatter. This is attributed to the T5 grade 305 powder with D90 <38μm and sphericity >94%, which has a small surface tension gradient during melting. Combined with <500ppm> For the LFP-JJY5RA-0107T3 Solder Paste commonly used in lighting LED production lines, although the sphericity is slightly lower than that of T4 powder (about 89%), due to the lower Ag content and better Cu ratio in the 0107 alloy, the solder joint height uniformity CV ≤4.7% can still be achieved at a peak temperature of 235℃. This shows that Domestic Solder Paste does not blindly pursue high sphericity, but matches the powder characteristics and thermodynamic window according to specific application scenarios, which is the core logic for the practical application of printed solder paste.