T3 Solder Paste for Medium-Fine Pitch Processes, SMT Reflow Stencil Printing Solder Paste

Selection of T3, T4, T5, and T6 Solder Powder Particle Sizes for Solder Paste: Fine-Pitch Applications

Solder paste selection must match the actual pad pitch and stencil aperture size. T3 to T6 solder powder particle sizes directly affect the printing accuracy and slump control of fine-pitch solder paste. Among them, T4 (25–45μm) is suitable for 0.4mm pin pitch, T5 (15–25μm) is adapted for fine-pitch solder paste applications of 0.3mm and below, while T6 (5–15μm) is only limited to CSP or FCCSP packages below 0.2mm and requires nitrogen reflow and high-precision printing equipment.