TDS LFP-JJY5RR-0307T4 T5 Halogen 0.00% and REACH Lead-free Solder Paste

This is zero‑halogen, REACH‑compliant lead‑free Solder Paste adopting low‑oxygen Sn99Ag0.3Cu0.7 solder powder and imported Flux raw materials.

Main Features

Printing performance: It features good stencil‑release property, stable viscosity and superior thixotropy during continuous printing. T4 grade fits stencil apertures down to 0.3 mm; finer T5 grade supports apertures as small as 0.15 mm, suitable for fine‑pitch QFN and BGA components. Optimized for low void rate (8‑15 %) and complies with IPC‑7095 Class 3. Excellent anti‑slump performance prevents component‑placement offset.

Post‑soldering reliability: Zero‑halogen formulation. Residues are minimal, transparent and non‑corrosive. No‑clean processing allows direct ICT testing. It passes copper‑mirror, humidity corrosion and long‑term electrochemical‑migration tests with high insulation resistance.

Solder joint performance: Bright, high‑conductivity solder joints with good tin‑wetting and climbing performance on gold‑plated PCB, QFN and SOP parts. Minimizes both chip‑area and random solder balls, improving reflow yield and reducing short‑circuit risks.

Key Technical Specifications

Flux Vehicle Properties

Viscosity: (150±20) Pa·S

Flux Content: T4 (11.2±0.5) %; T5 (11.7±0.5) %

Flux classification: ROL0 in accordance with IPC J‑STD‑004; Halide content: 0.00 %

Passes solder‑ball test, copper‑mirror test, humidity corrosion test and electrochemical‑migration resistance test

Spreadability: 85 %; Stencil working life:＞8 hours; Slump test: Pass

Refrigerated shelf‑life (0‑10 °C): 6 months

Alloy Characteristics

Alloy composition: Sn99Ag0.3Cu0.7, spherical powder; T4: 20‑38 μm, T5:15‑25 μm

Melting range: 217‑228 °C; Relative density:7.33 g/cm³; Resistivity:12‑13 μΩ·cm

Strict control on impurity elements including Cu, Sb, Zn, Bi, Al, As.

Process Guidelines

Storage & Pre‑use Preparation

Store at 0‑10 °C for 6‑month shelf‑life; maximum 5‑week storage under ≤25 °C ambient temperature. Do not mix paste scraped from stencil with unused solder paste; store recovered paste in separate containers.

Warm sealed paste container for 2‑4 hours until temperature ≥18 °C before opening to avoid moisture absorption that causes solder‑balling or spattering. Stir thoroughly for 1‑2 minutes before printing.

Printing Conditions

Compatible with manual, semi‑automatic and automatic printers. Squeegee angle:45‑60°, printing speed:20‑155 mm/s.

Squeegee pressure:0.018‑0.038 Kg/mm blade length; separation speed:1‑8 mm/s.

Recommended operating environment: 22‑28 °C, RH 30‑60 %. Complete component mounting within 4 hours after printing.

Reflow Soldering

Two reflow profiles are available: linear ramp profile and soak profile for high‑density assemblies.

Recommended peak temperature: 240‑260 °C; acceptable range:240‑268 °C

Recommended Time Above Liquidus(TAL):45‑60 s; acceptable range:30‑100 s

Recommended cooling rate:2‑6 °C/s.

The provided curves are lab‑test reference data. Users shall optimize parameters based on actual PCB, components and reflow equipment.

Packaging

Available options:500 g jars, 5 CC/10 CC/30 CC syringes, 6‑inch /12‑inch cartridges. Products are shipped in foam boxes with ice packs for cold‑chain transportation. Each package is labelled with product name, model, alloy grade, powder size, net weight, batch number, manufacturing date, validity period and manufacturer information.