TDS LFP-JJY5RNTT-105T4 HF No Clean Lead-free Solder Paste

This is a halogen‑free no‑clean lead‑free Solder Paste adopting Sn99Ag0.3Cu0.7 low‑oxygen solder powder and imported raw Flux materials. Its flux system shows good compatibility with most adhesives.

Key Product Features

Printing performance: Good stencil release, anti‑drying property and thixotropy. It supports fine‑pitch SMT printing for apertures as small as 0.3 mm, applicable to QFN, BGA and other fine‑pitch components. Viscosity drift is minor during continuous printing, delivering stable and repeatable printing results. Excellent slump resistance prevents post‑printing collapse and component placement offset.

Residue & reliability: Post‑soldering residues are minimal and transparent, non‑corrosive, and support direct ICT testing without cleaning. Halide content is below 0.002 %. High surface insulation resistance guarantees long‑term service stability.

Solder joint performance: Bright solder joints with superior conductivity. Good tin climbing performance on gold‑plated PCB, QFN and SOP devices. It suppresses BGA head‑in‑pillow (HIP) defects and reduces chip‑level and random solder‑ball formation to lower short‑circuit risks and improve reflow yield.

Core Technical Parameters

Flux System Properties

Viscosity: (170±20) Pa·S

Flux Content: (11.5±0.5) %; Flux classification: ROL0 per IPC J‑STD‑004

Halide content: ＜0.002 %; Copper mirror corrosion test: Pass

SIR: 1.0×10¹³ Ω (96 h, 35 °C /85 %RH); 1.0×10¹¹ Ω (7 days, 85 °C /85 %RH)

Spreadability: 85 %; Stencil working life: ＞8 hours; Slump test: Pass

Shelf‑life (2‑10 °C refrigerated): 6 months

Alloy Characteristics

Alloy composition: Sn98.5Ag1.0Cu0.5; Spherical powder, particle size 20‑38 μm

Melting range: 216‑227 °C

Includes density, resistivity and full‑set mechanical parameters covering tensile, shear, cyclic thermal fatigue and drop‑impact performance. Strict limits are imposed on impurity elements such as Zn and Ni.

Process Guidelines

Storage & Pre‑use Preparation

Keep refrigerated at 2‑10 °C for 6‑month shelf‑life; maximum 5‑week room‑temperature storage at ≤25 °C. Opened leftover paste shall be sealed and refrigerated; used paste shall not be mixed with unused material.

Sealed container warm‑up for 3‑5 hours to reach ≥18 °C before opening to avoid moisture absorption and solder spattering. Thoroughly stir 1‑4 minutes before printing.

Printing Conditions

Compatible with manual, semi‑automatic and automatic printers. Squeegee angle: 45‑75°, printing speed: 20‑100 mm/s. Recommended working environment: 25±5 °C, RH 40‑60 %.

Complete component mounting within 8 hours after printing. Keep workshop away from strong airflow. Clean stencil timely when printing performance degrades.

Reflow Soldering

Two ramp‑soak profile options are provided: high‑soak (170‑180 °C) and low‑soak (155‑175 °C).

Peak temperature range: 230‑245 °C; time above liquidus: 45‑90 seconds. Maintaining peak below 243 °C helps reduce voids for BGA/QFN.

Cooling rate: 1‑6 °C/s. Avoid excessively fast or slow cooling.

Note: The given reflow curve is lab reference data. Users need further optimisation for actual boards, components and equipment.

Packaging

Available in 500 g jars, 5 CC/10 CC/30 CC syringes, 6‑inch /12‑inch cartridges. Packed with ice packs inside foam boxes for cold‑chain transportation. Each unit is marked with model, alloy grade, powder size, net weight, batch number, manufacturing and expiry information.