TDS LFP-JJY5RR-305T4 T5 Halogen 0.00% and REACH Lead-free Solder Paste

This is zero‑halogen, REACH‑compliant lead‑free Solder Paste built on low‑oxygen Sn96.5Ag3.0Cu0.5 powder and imported Flux raw materials.

Main Features

Printing performance: Good stencil release and thixotropy, low viscosity drift in continuous printing. T4 suits apertures down to 0.3 mm; finer‑grade T5 supports stencil openings as small as 0.15 mm, for ultra‑fine‑pitch QFN, BGA assemblies. Low‑void performance (8‑15 % void rate) meets IPC‑7095 Class 3. Excellent anti‑slump prevents placement offset.

Post‑solder reliability: Zero‑halogen formula. Residues are sparse, transparent and non‑corrosive; no‑clean operation supports direct ICT testing. Passes copper‑mirror and long‑term humidity‑bias electrochemical‑migration tests with high insulation resistance.

Joint quality: Bright, highly‑conductive solder joints with good tin climbing on gold‑plated PCB, QFN and SOP. Minimizes chip‑level and random solder‑balls to raise reflow yield and reduce short‑circuit risk.

Key Technical Specifications

Flux Properties

Viscosity: (150±20) Pa·S; Flux Content: T4 (11.2±0.5) %, T5 (11.7±0.5) %

Flux classification: ROL0 (IPC J‑STD‑004); Halide content: 0.00 %

Passes solder‑ball, copper‑mirror and corrosion test; good electrochemical‑migration resistance

Spreadability:85 %; stencil life＞8 hours; slump test: Pass

Refrigerated shelf‑life (0‑10 °C):6 months

Alloy Parameters

Alloy: Sn96.5Ag3.0Cu0.5, spherical powder; T4:20‑38 μm, T5:15‑25 μm

Melting point:217 °C; tight control over impurity elements such as Pb, Fe, Zn, Bi, Ni.

Process Guidelines

Storage & Pre‑use Handling

Store refrigerated 0‑10 °C (6‑month shelf‑life); max 5‑weeks storage ≤25 °C ambient. Never mix stencil‑scraped paste with unused material.

Warm sealed paste 2‑4 hours to ≥18 °C before opening to avoid moisture‑induced spattering. Stir for 1‑2 min prior to printing.

Printing Conditions

Works for manual / semi‑auto / auto printers. Squeegee angle:45‑60°, printing speed:20‑155 mm/s.

Recommended environment:22‑28 °C, RH 30‑60 %. Complete component mounting within 4 hours after printing.

Reflow Soldering

Two profile options: linear ramp profile and soak profile for high‑density PCBA.

Peak temperature: recommended 230‑260 °C; acceptable 230‑265 °C

Time above liquidus(TAL): recommended 45‑60 s, acceptable 30‑100 s

Cooling rate: recommended 2‑6 °C/s.

Lab reference profiles only; users shall optimize according to actual boards, components and equipment.

Packaging

500 g jars; 5 CC/10 CC/30 CC syringes; 6‑inch /12‑inch cartridges. Cold‑chain packed with ice‑bags in foam boxes. Each unit is marked with product name, model, alloy grade, powder size, net weight, batch number, manufacturing & expiry date and manufacturer info.