TDS LFP-JJY5RTS-105T4 HF No Clean Lead-free Solder Paste

This is halogen‑free no‑clean lead‑free Solder Paste formulated with low‑oxygen Sn98.5Ag1.0Cu0.5 solder powder and imported Flux raw materials. Its flux system shows good compatibility with most adhesives, and it is also suitable for LED white PCBs.

Key Product Features

Printing performance: Good stencil release, anti‑drying property and thixotropy. It supports fine‑pitch SMT printing for stencil apertures as small as 0.3 mm for QFN, BGA and other fine‑pitch components. Viscosity drift is minor during continuous printing for stable and repeatable printing results. Superior anti‑slump performance maintains paste shape after printing and prevents component placement offset.

Post‑soldering reliability: Solder residues are minimal and transparent without corrosion. Cleaning is not required and direct ICT testing is available. High surface insulation resistance guarantees long‑term service stability.

Solder joint performance: Bright solder joints with excellent conductivity. It achieves 70%‑90% solder climbing height on gold‑plated PCBs and nickel‑plated pins for SOP, QFN/DFN devices. Effectively suppresses BGA Head‑in‑Pillow (HIP) defects. Chip‑level and random solder‑balls are minimized to lower short‑circuit risks and improve reflow yield.

Core Technical Parameters

Flux System Properties

Viscosity: (185±20) Pa·S

Flux Content: (12±0.5) %; Flux classification: ROL0 per IPC J‑STD‑004

Halide content: ＜0.05 %

Surface Insulation Resistance: 1.0×10¹³ Ω (96 h, 35 °C /85 %RH); 1.0×10¹¹ Ω (7 days, 85 °C /85 %RH)

Spreadability: 85 %; Stencil working life: ＞8 hours; Slump test: Pass

Refrigerated shelf‑life (2‑10 °C): 6 months

Alloy Characteristics

Alloy grade: Sn98.5Ag1.0Cu0.5; spherical powder, particle size 20‑38 μm

Melting range: 216‑227 °C

Relative density:7.34 g/cm³; Resistivity:12.5 μΩ·cm

Complete mechanical data including yield strength, tensile strength, shear strength, thermal‑cycle fatigue and drop‑impact performance. Strict limits are set for impurity elements such as Sb, Zn, As, Ni and Cd.

Process Guidelines

Storage & Pre‑use Preparation

Keep refrigerated at 2‑10 °C for 6‑month shelf‑life; maximum 5‑week room‑temperature storage at ≤25 °C. Opened leftover paste shall be sealed and refrigerated. Paste scraped from stencils must not be mixed with unused material and should be stored in separate containers.

Warm the sealed paste container for 3‑5 hours until temperature ≥18 °C before opening to avoid moisture absorption leading to solder‑balling or spattering. Thoroughly stir for 1‑4 minutes prior to printing.

Printing Conditions

Compatible with manual, semi‑automatic and automatic printers. Squeegee angle:45‑75°, printing speed:20‑100 mm/s. Recommended workshop environment:25±5 °C, RH 40‑60 %.

Complete component mounting within 8 hours post‑printing. Avoid strong airflow in production workshop. Timely clean stencil when printing performance degrades.

Reflow Soldering

Two ramp‑soak profile options are provided: high‑soak (170‑180 °C) and low‑soak (155‑175 °C).

Peak temperature range:230‑245 °C; time above liquidus:45‑90 seconds. Maintaining peak temperature below 243 °C helps reduce voids for BGA/QFN packages.

Cooling rate:1‑6 °C/s. Avoid excessively fast or slow cooling.

Note: The reflow curve is lab‑reference data. Users need further optimisation for actual boards, components and reflow equipment.

Packaging

Available in 500 g jars, 5 CC /10 CC /30 CC syringes, 6‑inch /12‑inch cartridges. Cold‑chain transportation with ice‑bags inside foam boxes. Each package is marked with product name, model, alloy grade, powder size, net weight, batch number, manufacturing date, expiry date and manufacturer information.