This document covers a single‑core Solder Wire with Sn63/Pb37 alloy, 1.0 mm diameter and 2 % Flux Content.
Physical Inspection
Appearance: Bright and smooth, tested compliant.
Diameter: Nominal 1.0 mm with tolerance ±0.05 mm, tested compliant.
Chemical & Functional Performance
Bromine content: 0.031 %; Chlorine content: 0 %.
Spreadability: Above 85 %.
Dryness: Chalk powder on samples can be easily removed, meeting requirements.
Surface Insulation Resistance (SIR): Greater than 1×10⁸ Ω.
Corrosion test: Non‑corrosive.
Flux weight percentage: 2±0.3 %, within specification.
Applicable working temperature range: 280‑330 °C.
Alloy Composition
Nominal alloy composition: Tin 63±1 wt%, lead as balance.
Maximum allowable impurity limits (wt%):
Zn ≤0.002, Ag ≤0.1, Al ≤0.002, As ≤0.02, Bi ≤0.03, Cd ≤0.002, Cu ≤0.03, Fe ≤0.02, Ni ≤0.01, Sb ≤0.1.
Measured tin content is 62.57 wt%. All impurity items pass inspection.
All test items of this solder wire have obtained passing results.
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