TDS LFP-JJY5RNTT-305T4 HF No Clean Lead-free Solder Paste

This is halogen‑free no‑clean lead‑free Solder Paste formulated with low‑oxygen Sn96.5Ag3.0Cu0.5 solder powder and imported Flux raw materials. Its flux system exhibits good compatibility with most adhesives.

Key Product Features

Printing performance: It delivers excellent stencil release, anti‑drying property and thixotropy. It supports fine‑pitch SMT printing for stencil apertures down to 0.3 mm, suitable for QFN, BGA and other fine‑pitch components. Viscosity variation remains small during continuous printing to ensure stable and repeatable printing output. Superior anti‑slump performance preserves paste shape after printing and prevents component placement offset.

Post‑solder reliability: Solder residues are minimal and transparent without corrosion. Cleaning is not required and direct ICT testing is available. Halide content is less than 0.002 %. High surface insulation resistance ensures long‑term operational stability of assembled assemblies.

Solder joint performance: Bright solder joints with outstanding conductivity. It realizes sufficient tin climbing on gold‑plated PCBs, QFN and SOP devices. The paste effectively inhibits BGA Head‑in‑Pillow (HIP) defects. Chip‑level and random solder‑balls are minimized, lowering short‑circuit risks and improving overall reflow yield.

Core Technical Parameters

Flux Vehicle Properties

Viscosity: (170±20) Pa·S

Flux Content: (11.5±0.5) %; Flux classification: ROL0 (compliant with copper mirror test) per IPC J‑STD‑004

Halide content: ＜0.002 %

Surface Insulation Resistance: 1.0×10¹³ Ω (96 h, 35 °C /85 %RH); 1.0×10¹¹ Ω (7 days, 85 °C /85 %RH)

Spreadability: 85 %; Stencil working life: ＞8 hours; Slump test: Pass

Refrigerated shelf‑life (2‑10 °C): 6 months

Alloy Characteristics

Alloy grade: Sn96.5Ag3.0Cu0.5; spherical powder with particle size 20‑38 μm

Melting point: 217 °C

Relative density: 7.31 g/cm³; Resistivity:12 μΩ·cm

Mechanical metrics: yield strength 41.5 MPa, elongation 43.5 %, tensile strength 46.5 MPa, shear strength 38 MPa; parameters for long‑term bearing fatigue, thermal‑cycle fatigue and drop‑impact resistance are specified. Impurity elements such as Bi and As are subject to strict content limits.

Process Guidelines

Storage & Pre‑treatment

Store refrigerated between 2‑10 °C for 6‑month service life. Maximum 5‑week storage at ambient temperature ≤25 °C. Sealed refrigeration is required for leftover paste after opening. Used paste scraped from stencils must not be mixed with unused paste; store it in separate containers.

Warm the sealed paste container for 3‑5 hours until temperature ≥18 °C before opening, to avoid moisture absorption that causes solder‑balling or spattering during reflow. Stir fully for 1‑4 minutes prior to printing.

Printing Conditions

Compatible with manual, semi‑automatic and automatic printers. Squeegee angle: 45‑75°, printing speed: 20‑100 mm/s. Recommended workshop condition: 25±5 °C, relative humidity 40‑60 %.

Complete component mounting within 8 hours post‑printing. Avoid strong air flow in production area. Clean stencil timely when printing quality degrades.

Reflow Soldering

Two ramp‑soak reflow profiles are selectable: high‑soak mode (170‑180 °C) and low‑soak mode (155‑175 °C).

Peak temperature: 230‑245 °C; time above liquidus: 45‑90 seconds. Holding peak temperature below 243 °C helps reduce voids for BGA and QFN packages.

Cooling rate: 1‑6 °C/s. Neither excessively fast nor slow cooling is permitted.

Note: The provided reflow curve serves as lab‑tested reference data. Users shall optimize parameters according to actual PCBs, components and reflow equipment.

Packaging

Available forms: 500 g jars, 5 CC /10 CC /30 CC syringes, 6‑inch /12‑inch cartridges. Products are packed in foam boxes with ice packs for cold‑chain transportation. Each package is labelled with product name, model, alloy type, powder size, net weight, batch number, manufacturing date, validity period and manufacturer information.