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Here you can find knowledge about Board Cleaner, including but not limited to usage methods, installation techniques, troubleshooting and more. Focused on SMT soldering processes. If you can't find what you need, please contact us anytime.
Cleaning the furnace chamber during daily maintenance of reflow ovens is a key measure to prevent carbonized flux residue from contaminating PCB surfaces. Operations must account for the softening characteristics of residues under a nitrogen atmosphere, the matching degree between chain speed and temperature zone settings, and the unique furnace chamber structural design of Jiajinyuan reflow ovens, to avoid carbon buildup in high-temperature zones that could cause continuous surface yellowing or solder bead defects.
Published: 2019-08-11Selective wave soldering performs dip soldering on local pins of the PCB through precise positioning, avoiding the thermal shock and bridging risks caused by passing the entire board through the wave. It is suitable for complex single boards with mixed high-density mounting, sensitive components, or bottom shielding covers. In actual tests with Jiajinyuan equipment, the defect rate can be reduced from 1.2% to 0.35%, greatly reducing rework labor and solder dross loss.
Published: 2019-06-28When soldering thick copper PCBs and multilayer boards with BGA, the significantly increased thermal capacity means conventional heating parameters can easily cause cold solder joints or chip warpage. It is necessary to specifically extend the preheating time, increase the temperature of the soaking zone, and slow down the peak heating slope to ensure synchronous melting of solder balls and overall thermal balance of the PCB.
Published: 2019-04-12X-Ray inspection is an irreplaceable quality control method in the mass production of new energy battery management systems, medical imaging equipment motherboards, and 5G communication base station PCBs. It can penetrate multi-layer stacked structures to accurately identify defects invisible to the naked eye such as BGA cold solder joints, PTH via copper fractures, and embedded capacitance offset. Jiajinyuan X-Ray inspection equipment achieves a 99.2% defect capture rate at a 0.5μm detail resolution, and has become a mandatory verification step before batch shipment on high-end SMT production lines.
Published: 2019-01-21When manually soldering mobile phone motherboards, thin-diameter solder wire can precisely cover pads below 0.3mm, avoiding bridging and cold solder joints. Combined with a constant-temperature soldering iron and a high-magnification microscope, it enables reliable connections of tiny solder joints such as peripheral resistors and capacitors around BGA and cable interfaces, making it an indispensable practical process for rework production lines to handle high-density PCBs.
Published: 2018-12-11During soldering of ENIG boards, the wettability of solder paste directly affects the formation quality of solder joints. Jiajinyuan solder paste demonstrates excellent spreading ability and low void rate on ENIG boards. With a conventional reflow profile, it can achieve full solder joints, complete pin wrapping, and eliminate common production line defects such as solder spikes and cold solder joints.
Published: 2018-09-28Due to the large heat capacity and slow heating rate of thick copper plate welding, wave soldering is prone to missing solder. Selecting high-wettability solder bars can significantly improve the spreading ability of molten solder on thick copper substrates. Combined with the collaborative optimization of process parameters such as increasing the preheating temperature to 130℃～140℃ and reducing the chain speed to 1.0m/min～1.2m/min, it effectively solves problems such as insufficient solder joints, bridging defects, and cold solder on the back of the PCB.
Published: 2018-08-29To address persistent issues such as uneven solder paste deposition, cold soldering, and solder bridging during thick copper foil soldering on multilayer boards, this paper draws on 20 years of measured data from Jia Jinyuan's production lines, focuses on precise solder paste dosage control methods, and details the matching logic for thick copper solder paste printing parameters, covering key actions such as stencil aperture design, squeegee pressure and speed coordination, and SPI detection threshold setting before reflow soldering.
Published: 2018-02-09During the soldering process of OSP boards, pad oxidation is the main cause of cold solder joints and poor wetting. Reasonably setting the reflow profile can effectively suppress copper surface oxidation, with the key being to control the heating rate, shorten the high-temperature exposure time, and ensure the peak temperature accurately falls within the 195℃~210℃ range. Production line verification by Jiajinyuan shows that when the TAL time exceeds 60 seconds or the peak temperature exceeds 212℃, the decomposition of the OSP film accelerates, and the risk of pad oxidation increases sharply.
Published: 2017-08-04The solder for industrial control motherboards is specifically designed for high-reliability soldering of industrial control motherboard PCBA. It features excellent wettability, low void rate, and strong thermal cycle resistance, meeting the demands of harsh scenarios such as wide temperature range, long service life, and vibration resistance. It is a core material for ensuring the long-term stability of solder joints on industrial control motherboards.
Published: 2017-06-01Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.