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The solder used in energy storage modules is extremely sensitive to voiding rate. Low-void solder paste can control the voiding rate of BGA solder joints within 5%, significantly improving the thermal fatigue life of electronic control boards under high-power cycling. Jiajinyuan JY-810A solder paste, with its stable thixotropy, low residue, and reflow wetting angle of less than 25°, has become a practical combination for BGA soldering of electronic control boards in the selection of solder materials for energy storage modules.
Published: 2017-04-04Jiajinyuan PCBA soldering materials are specifically designed for new energy battery management system BMS boards, photovoltaic inverter control boards, and industrial PLC main control boards. Its low-void-rate solder paste maintains a stable void area of less than 12% after reflow in 0.3mm fine-pitch QFN packages, which can be further reduced to 8.5% with a nitrogen atmosphere, meeting the stringent requirements of automotive-grade AEC-Q200 for solder joint reliability.
Published: 2016-12-27High-frequency PCB soldering is extremely sensitive to the halogen content and residue control of solder paste. Jiajinyuan halogen-free low-residue solder paste, by optimizing the rosin system and activator ratio, ensures wettability while reducing ionic contamination to below 0.25μg/cm2, significantly minimizing impedance fluctuations and phase shifts in high-frequency signal transmission.
Published: 2016-12-13Humidity control in the immersion silver board welding workshop is a key process measure to suppress silver layer migration. When the ambient relative humidity is higher than 60%RH for a long time, an electrolyte film is easily formed on the surface of the immersion silver board, which accelerates the electrochemical migration of silver ions between the pad and the edge of the solder mask. Actual measurements on the Jia Jinyuan production line show that stably controlling the humidity within the range of 40% to 55%RH can reduce the silver migration failure rate by 72%. Combined with nitrogen-protected reflow soldering and matching the activity level of the solder paste, it can significantly improve the long-term reliability of immersion silver board welding.
Published: 2016-11-22To address the issue of solder joint cracking caused by concentrated thermal stress in energy storage new energy electronic control boards during frequent charge-discharge cycles, solder paste with high ductility, low elastic modulus, and excellent thermal cycle life must be selected. New energy solder paste must pass thermal shock verification at -40℃ to 125℃ for more than 1000 cycles, while reliability solder paste emphasizes the uniformity of the IMC layer and the stability of the Cu6Sn5 phase. The metal content, particle size distribution, and flux residue ion concentration of the solder paste jointly determine its long-term thermal fatigue resistance.
Published: 2016-07-02First Article Inspection is a full-item verification action performed on the first PCB after the SMT production line starts up and changes boards, covering key links such as solder paste printing, placement accuracy, reflow soldering effect, and AOI false alarm rate. It compares measured data with process parameters and BOM/GERBER consistency to avoid risks of batch material misplacement, offset, or cold soldering, ensuring an accurate and reliable starting point for process control.
Published: 2016-05-17High-frequency board welding imposes extremely high requirements on the thermal sensitivity of the substrate. Materials such as PTFE and ceramic-filled PP generally have a glass transition temperature below 170°C. If the peak reflow temperature exceeds 260°C, it can easily cause delamination, blistering, or dielectric constant drift. Actual measurements on Jiajinyuan's production line show that 255°C is the safe threshold for most high-frequency board welding. Thermal damage must be avoided through stepwise heating, reducing residence time in the high-temperature zone, and nitrogen atmosphere control.
Published: 2015-10-08Automotive electronic solder must meet the long-term reliability requirements of vehicle-mounted circuit boards under high-temperature, high-humidity, and strong-vibration environments. Jiajinyuan automotive electronic solder adopts a low-silver lead-free formula, delivers stable wettability at a peak reflow temperature of 260℃, controls the IMC layer thickness within the range of 3.2～4.8μm, effectively suppresses solder joint crack propagation, has obtained AEC-Q200 certification, and is used in mass production on ADAS domain controller PCBA production lines.
Published: 2015-08-30When soldering precision sensor circuit boards with immersion silver boards, the excellent solder joint stability stems from the high density of the immersion silver layer, controllable interfacial reaction, and strong thermal cycle resistance. Jiajinyuan immersion silver boards have a measured thrust of over 85gf on 0.15mm fine-pitch BGA and 0.3mm pitch MEMS sensor pads, with an IMC thickness fluctuation of less than 0.12μm after reflow, significantly outperforming conventional OSP boards.
Published: 2015-01-17OSP board soldering is a critical process in SMT production lines that is highly prone to cold solder joints, poor wetting, and pad oxidation failures. It is necessary to optimize stencil aperture design, solder paste selection, reflow profile, and first-article verification process in response to the thermal sensitivity, thin-layer characteristics, and weak adhesion to the copper substrate of the OSP anti-oxidation protective film. Otherwise, even if the placement accuracy meets the standards, batch issues such as dull solder joints, insufficient solder climb height, or abnormal ICT test impedance will occur after reflow.
Published: 2014-11-10Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.