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The solder used in energy storage modules directly determines the welding reliability of energy storage power supply protection boards and inverters. Jiajinyuan solder exhibits no cracks, low void rate, and an interface IMC thickness controlled at 3.2±0.4μm in 125℃ high-temperature cycle tests, and its wetting and spreading consistency on copper substrates and nickel-plated terminals is superior to that of common industry-standard tin-silver-copper systems.
Published: 2014-10-21During the FPC soldering process, the flexible board is prone to deformation when heated, which is a high-frequency failure point on the production line. Engineers from Jia Jinyuan adopted a combination of measures, including optimizing stencil aperture design, adjusting reflow soldering conveyor speed and temperature gradient, and using dedicated fixtures for pressing, to increase the first-pass yield of FPC soldering from 72% to 96.5%, focusing on solving three major pain points: solder paste misalignment, insufficient solder wetting on pads, and substrate wrinkling.
Published: 2014-06-09In circuit board soldering, cold solder joints, solder beads, and voids are high-frequency defects on production lines, directly affecting first-pass yield and long-term reliability. Based on 20 years of practical data from the Jiajinyuan SMT production line, this paper focuses on key intervention points such as solder paste printing accuracy, dynamic matching of reflow profiles, stencil aperture optimization, and nitrogen concentration gradient control, and provides immediately implementable parameter adjustment combinations and failure reproduction verification methods.
Published: 2014-05-14
When manually repairing circuit boards, the selection of solder wire diameter directly affects solder joint formation and rework yield. 0.3mm solder wire is suitable for fine touch-up soldering and jumper wiring of small-size SMD components such as 0402 and 0603, while 0.5mm solder wire is more suitable for rapid tinning of QFP pins, power ground pads and large-area copper foils. 20 years of production line tests by JJY show that there are significant differences in melting consistency and wetting spreading ability between the two under the conditions of soldering iron temperature of 320℃ and dwell time of 2 seconds.
Published: 2014-01-28When reworking and welding precision motherboards, precise temperature control must be applied to protect surrounding micro components. The Jiajinyuan JRY-850B hot air system, paired with an infrared temperature gun for real-time feedback, controls the peak temperature of BGA solder joints at 235±2℃ and limits the temperature rise of surrounding 0201 resistors to below 120℃, avoiding PCB delamination or MLCC hidden cracks caused by thermal stress.
Published: 2014-01-10Soldering thick-copper PCBs places extremely high demands on solder paste rheology, wetting force, and anti-slump performance. During selection, practical production-line issues caused by thick copper—such as rapid heat dissipation, high pad thermal mass, and high tendency of printing misalignment—must be comprehensively considered. Priority should be given to thick-copper solder pastes with high metal content, low thixotropic index, and specially formulated active flux, to ensure sufficient wetting and reliable solder joint formation under conventional reflow profile conditions.
Published: 2013-09-16To meet the actual production line requirements for solder materials used in industrial control motherboards, this summary focuses on the compatibility issues of solder paste in SMT printing, reflow soldering and wave soldering processes, and elaborates on the synergistic performance of Jiajinyuan solder paste and matching solder bars in high-reliability soldering, covering key process parameters such as viscosity adaptation, metal content control, and residue corrosion inhibition.
Published: 2013-06-25Gold-plated board soldering undertakes high-reliability connection tasks in the manufacturing of medical and precision instrument PCBs. Its surface process must balance solderability, corrosion resistance, and long-term signal stability. Gold-plated board soldering is particularly suitable for scenarios requiring micro pads, high-frequency devices, and low contact resistance. Gold layer thickness control, nickel barrier integrity, and reflow parameter matching are key bottlenecks for mass production yield.
Published: 2013-06-11High-frequency board welding is extremely sensitive to solder paste voiding rate. Dielectric parameter fluctuations caused by voids directly degrade signal integrity. Jiajinyuan low-void solder paste, by optimizing metal content, flux volatilization gradient and reflow wetting dynamics, stably controls the voiding rate of BGA solder joints within 3.2% in 5G RF module tests, significantly suppressing insertion loss drift in high frequency bands.
Published: 2013-05-22For reworking oxidized PCB pads, two issues must be addressed simultaneously: the surface oxide layer and poor wetting. Jia Jinyuan high-activity flux can effectively reduce CuO and lower interfacial tension. Combined with light mechanical scraping and nitrogen-protected reflow, it raises the first-pass rework yield of oxidized pads to over 92%, significantly outperforming the 65% achieved by traditional rosin-based flux.
Published: 2012-09-29Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.