SMT Solder Paste Manufacturers.
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The solder used for industrial control motherboards can maintain the structural integrity of solder joints under high and low temperature cycling environments ranging from -40°C to 85°C. This relies on the optimization of Jia Jinyuan's solder alloy ratio, precise matching of reflow profiles, and coordinated control of PCB copper thickness and pad design, to avoid microcrack propagation caused by thermal stress accumulation.
Published: 2010-02-18High-frequency PCB soldering is a core step in 5G high-frequency PCB SMT soldering, which directly determines signal integrity and transmission stability in the millimeter-wave frequency band. Jiajinyuan has verified on substrates including FR4, Rogers, and Taconic that the solder paste filling rate of 0.15mm micro-via pads is >92%, and the post-reflow coplanarity is ≤18μm. By optimizing squeegee pressure and trapezoidal compensation for stencil apertures, the high-frequency PCB soldering yield is stably maintained above 99.3%.
Published: 2010-01-11The selection of solder paste for power boards must balance solder climbing capability, void rate, and halogen residue. Domestic solder pastes such as the 8MQP/5RQ series achieve nearly 100% solder climbing on QFN/DFN devices, while the 8M9P/5RR series is halogen-free with an extremely low void rate. The T4-grade 0307 alloy powder used in SMT solder paste forms stably within the 240–260°C reflow window. Domestic solder pastes now cover application scenarios ranging from communication motherboards to automotive lighting.
Published: 2009-05-15Multiple domestic solder pastes were tested for key indicators including QFN solder climb rate, void control, and residue transparency. PCB solder paste selection must match the specific process window. The activity of soldering paste is inversely proportional to its halogen content. Domestic solder pastes now cover the full gradient from zero-halogen ROL0 to halogen-free ROL1. 8M9P/5RR achieves automotive lighting-grade low void rates, while 8MNTTP/5RNTT achieves over 90% solder climb on high-density pads of mobile phone motherboards.
Published: 2009-04-25To address production-line pain points in new energy circuit board soldering, such as poor solder climbing, high voiding rate, and excessive halogen residue, this paper draws on 20 years of frontline SMT experience to recommend multiple domestic solder pastes suitable for QFN/DFN packages, automotive lighting, and high-precision communication modules, covering niche scenarios including zero-halogen, water-washable, laser-specific, and ultra-low-temperature formulations. It focuses on analyzing the real process performance of the 8MQP/5RQ, 8M9P/5RR, and 8MW5/5RW5 series in meeting the three core demands for new energy solder paste, PCB solder paste, and domestic solder paste.
Published: 2009-04-05Communication motherboards have extremely high requirements for solder paste's wetting ability, residue transparency, and halogen control. The 8MNTTP/5RNTT series communication board solder paste launched by domestic solder paste brand Jiajinyuan contains only 100~200ppm halogen, with minimal and transparent residue. It is compatible with high-density packages such as QFN/DFN, and achieves high-reliability solder paste performance when paired with 00507BN/T5 ultra-fine powder. It has been batch-verified on 5G base station motherboards.
Published: 2009-03-08Insufficient solder is a frequently occurring soldering defect in SMT production lines, especially prominent on large pad designs and PCBs with copper thickness of 2oz or above. Its essence is the combined effect of decreased solder paste transfer rate and insufficient wetting during the printing, placement, and reflow stages, requiring coordinated intervention across multiple links such as stencil aperture, squeegee pressure, peak temperature of the reflow profile, and nitrogen purity.
Published: 2009-02-24Our technical team is always ready to provide professional solder material selection advice and SMT process solutions.